High-Voltage Bias-Switching Electronics for Volumetric Imaging using Electrostrictive Row-Column Arrays.

Top Orthogonal to Bottom Electrode (TOBE) arrays, also known as row-column arrays, hold great promise for fast high-quality volumetric imaging. Bias-voltage-sensitive TOBE arrays based on electrostrictive relaxors or micromachined ultrasound transducers can enable readout from every element of the array using only row and column addressing. However, these transducers require fast bias-switching electronics which are not part of a conventional ultrasound system and are non-trivial. Here we report on the first modular bias-switching electronics enabling transmit, receive, and biasing on every row and every column of TOBE arrays, supporting up to 1024 channels. We demonstrate the performance of these arrays by connection to a transducer testing interface board and demonstrate 3D structural imaging of tissue and 3D power Doppler imaging of phantoms with realtime B-scan imaging and reconstruction rates. Our developed electronics enable interfacing of bias-switchable TOBE arrays to channel-domain ultrasound platforms with software-defined reconstruction for next-generation 3D imaging at unprecedented scales and imaging rates.

Transparent capacitive micromachined ultrasound transducer linear arrays for combined realtime optical and ultrasonic imaging.

Transparent ultrasound transducers could enable many novel applications involving both ultrasonics and optics. Recently, we reported transparent capacitive micromachined ultrasound transducers (CMUTs) and demonstrated through-illumination photoacoustic imaging. This work presents the feasibility of transparent CMUTs for combined ultrasound imaging and through-array white-light imaging with a miniature camera placed behind the array. Transparent CMUT devices are fabricated with an adhesive wafer bonding technique and provide high transparency up to 90% in visible wavelengths. Fabricated linear arrays have a central operating frequency of 9 MHz with 128 active elements. Realtime plane-wave imaging is performed for ultrasound imaging, and lateral and axial resolutions of, respectively, 234 and 338 µm are achieved. Transparent CMUT has demonstrated a high transmit sensitivity of 1.4 kPa/V per channel with a 100 VDC bias voltage. The signal-to-noise ratio for a beamformed image of wire targets is determined to be 28.4 dB. To the best of our knowledge, this is the first report of combined realtime optical and ultrasonic imaging with transparent arrays. This technology may enable one to visually see what is being scanned and scan what one sees without co-registration errors. Future applications could include multi-modality probes for interventional and surgical procedures.

Dual-Frequency CMUT Arrays for Multiband Ultrasound Imaging Applications.

Dual-frequency capacitive micromachined ultrasonic transducers (CMUTs) are introduced for multiscale imaging applications, where a single array transducer can be used for both deep low-resolution imaging and shallow high-resolution imaging. These transducers consist of low- and high-frequency membranes interlaced within each subarray element. They are fabricated using a modified sacrificial release process. Successful performance is demonstrated using wafer-level vibrometer testing, as well as acoustic testing on wirebonded dies consisting of arrays of 2- and 9-MHz elements of up to 64 elements for each subarray. The arrays are demonstrated to provide multiscale, multiresolution imaging using wire phantoms and can span frequencies from 2 MHz up to as high as 17 MHz. Peak transmit sensitivities of 27 and 7.5 kPa/V are achieved with the low- and high-frequency subarrays, respectively. At 16-mm imaging depth, lateral spatial resolution achieved is 0.84 and 0.33 mm for low- and high-frequency subarrays, respectively. The signal-to-noise ratio of the low-frequency subarray is significantly higher for deep targets compared to the high-frequency subarray. The array achieves multiband imaging capabilities difficult to achieve with current transducer technologies and may have applications to multipurpose probes and novel contrast agent imaging schemes.

Transparent capacitive micromachined ultrasonic transducer (CMUT) arrays for real-time photoacoustic applications.

Photoacoustic imaging has shown great potential for non-invasive high-resolution deep-tissue imaging. Minimizing the optical and acoustic paths for excitation and detection could significantly increase the signal-to-noise ratio. This could be accomplished by transparent transducers permitting through-transducer illumination. However, most ultrasound transducers are not optically transparent. Capacitive micromachined ultrasound transducer (CMUT) technology has compelling properties compared to piezoelectric transducers such as wide bandwidth and high receive sensitivity. Here, we introduce transparent CMUT linear arrays with high transparency in the visible and near-infrared range. To fabricate the devices, we used an adhesive wafer bonding technique using photosensitive benzocyclobutene (BCB) as both a structural and adhesive layer with a glass-indium-tin-oxide (ITO) substrate. Silicon nitride is used as the membrane material ensuring hermiticity and optical transparency. Our fabricated transducer arrays consist of 64 and 128 elements with immersion operation frequency of 8 MHz, enabling high-resolution imaging. ITO, along with thin metal strips, are used as a conductive layer for the top electrodes with minimal impact on device transparency. Fabricated devices have shown average transparency of 70% in the visible wavelength range that goes up to 90% in the near-infrared range. Arrays are wire-bonded to interfacing electronics and connected to a research ultrasound platform for phantom imaging. Arrays exhibited signal-to-noise (SNR) of 40 dB with 30V bias voltage and laser fluence of 13.5 mJ/cm2. Arrays with 128 channels provided lateral and axial resolutions of 234 µm and 220 µm, respectively.