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1.
Sensors (Basel) ; 24(11)2024 May 31.
Artículo en Inglés | MEDLINE | ID: mdl-38894338

RESUMEN

Negative temperature coefficient (NTC) chip thermistors were thermally coupled to form a novel device (TCCT) aimed for application in microelectronics. It consists of two NTC chip thermistors Th1 and Th2, which are small in size (0603) and power (1/10 W). They are in thermal junction, but concurrently they are electrically isolated. The first thermistor Th1 generates heat as a self-heating component at a constant supply voltage U (input thermistor), while the second thermistor Th2 receives heat as a passive component (output thermistor). The temperature dependence R(T) of NTC chip thermistors was measured in the climatic test chamber, and the exponential factor B10/30 of thermistor resistance was determined. After that, a self-heating current I1 of the input thermistor was measured vs. supply voltage U and ambient temperature Ta as a parameter. Input resistance R1 was determined as a ratio of U and I1 while output thermistor resistance R2 was measured by a multimeter concurrently with the current I1. Temperatures T1 and T2 of both thermistors were determined using the Steinhart-Hart equation. Heat transfer, thermal response, stability, and inaccuracy were analyzed. The application of thermally coupled NTC chip thermistors is expected in microelectronics for the input to output electrical decoupling/thermal coupling of slow changeable signals.

2.
Heliyon ; 10(4): e26069, 2024 Feb 29.
Artículo en Inglés | MEDLINE | ID: mdl-38420460

RESUMEN

This work presents a novel approach towards integrating electronic components with textiles, by successfully creating a fully textile-based element that is capable of detecting applied forces by variation in its resistance value. The fabrication of the device consists of a specialized siliconized conductive fabric, which is placed above and below a layer of switch fabric, which acts as a force sensor. In this paper, the effects of three different geometries are observed, as well as the washability of the device, along with tension testing. Μoreover, the device behavior is simulated as well as applied in a real-life scenario. The proposed element demonstrates a good dynamic range, high repeatability and stability, and minimal impact of washing, creating a great candidate for integration in e-textiles.

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