RESUMEN
Electronic systems and devices operating at significant power levels demand sophisticated solutions for heat dissipation. Although materials with high thermal conductivity hold promise for exceptional thermal transport across nano- and microscale interfaces under ideal conditions, their performance often falls short by several orders of magnitude in the complex thermal interfaces typical of real-world applications. This study introduces mechanochemistry-mediated colloidal liquid metals composed of Galinstan and aluminium nitride to bridge the practice-theory disparity. These colloids demonstrate thermal resistances of between 0.42 and 0.86 mm2 K W-1 within actual thermal interfaces, outperforming leading thermal conductors by over an order of magnitude. This superior performance is attributed to the gradient heterointerface with efficient thermal transport across liquid-solid interfaces and the notable colloidal thixotropy. In practical devices, experimental results demonstrate their capacity to extract 2,760 W of heat from a 16 cm2 thermal source when coupled with microchannel cooling, and can facilitate a 65% reduction in pump electricity consumption. This advancement in thermal interface technology offers a promising solution for efficient and sustainable cooling of devices operating at kilowatt levels.
RESUMEN
Dielectric polymer composites for film capacitors have advanced significantly in recent decades, yet their practical implementation in industrial-scale, thin-film processing faces challenges, particularly due to limited biaxial stretchability. Here, we introduce a mechanochemical solution that applies liquid metal onto rigid dielectric fillers (e.g. boron nitride), dramatically transforming polymer-filler interface characteristics. This approach significantly reduces modulus mismatch and stress concentration at the interface region, enabling polypropylene composites to achieve biaxial stretching ratio up to 450 × 450%. Furthermore, liquid metal integration enhances boron nitride's dielectric polarization while maintaining inherent insulation, producing high-dielectric-constant, low-loss films. These films, only microns thick yet quasi square meters in area, achieve a 55% increase in energy density over commercial biaxially-oriented polypropylene (from 2.9 to 4.5 J cm-3 at 550 MV/m), keeping 90% discharge efficiency. Coupled with improved thermal conductivity, durability, and device capacitance, this distinctive interface engineering approach makes these composites promising for high-performance film capacitors.
RESUMEN
Efforts to directly utilize thixotropic polymer composites for out-of-plane thermal transport applications, known as thermal interface materials (TIMs), have been impeded by their mediocre applied thermal resistance (Reff) in a sandwiched structure. Different from traditional attempts at enhancing thermal conductivity, this study proposes a low-bond line thickness (BLT) path for mitigating the sandwiched thermal impedance. Taking the most common TIM, polydimethylsiloxane/aluminum oxide/zinc oxide (PDMS/Al2O3/ZnO), as an example, liquid metal is designed to on-demand localize at the Al2O3-polymer and Al2O3-filler interface regions, breaking rheological challenges for lowering the BLT. Specifically, during the sandwiched compression process, interfacial LM is just like the lubricant, dexterously promoting the relaxation of immobilized PDMS chains and helping fillers to flow through mitigating the internal friction between Al2O3 and adjacent filler. As a result, this TIM first time exhibits a boundary BLT (4.28 µm) that almost approaches the diameter of the maximum filler and performs an ultralow dry-contact Reff of 4.05 mm2 K/W at 40 psi, outperforming most reported and commercial dry-contact TIMs. This study of the low-BLT direction is believed to point to a new path for future research on high-performance TIMs.
RESUMEN
Strong and ductile adhesives often undergo both interfacial and cohesive failure during the debonding process. Herein, we report a rare self-reinforcing polyurethane adhesive that shows the different phenomenon of only interfacial failure yet still exhibiting superior adhesive strength and toughness. It is synthesized by designing a hanging adhesive moiety, hierarchical H-bond moieties, and a crystallizable soft segment into one macromolecular polyurethane. The former hanging adhesive moiety allows the hot-melt adhesive to effectively associate with the target substrate, providing sufficient adhesion energy; the latter hierarchical H-bond moieties and a crystallizable soft segment cooperate to enable the adhesive to undergo large lap-shear deformations through sacrificing weak bonds and mechano-responsive strength through the fundamental mechanism of strain-induced crystallization. As a result, this polyurethane adhesive can keep itself intact during the debonding process while still withstanding a high lap-shear strength and dissipating tremendous stress energy. Its adhesive strength and work of debonding are as high as 11.37 MPa and 10.32 kN m-1, respectively, outperforming most reported tough adhesives. This self-reinforcing adhesive is regarded as a new member of the family of strong and ductile adhesives, which will provide innovative chemical and structural inspirations for future conveniently detachable yet high-performance adhesives.