Thermoelectric performance of a metastable thin-film Heusler alloy.

Thermoelectric materials transform a thermal gradient into electricity. The efficiency of this process relies on three material-dependent parameters: the Seebeck coefficient, the electrical resistivity and the thermal conductivity, summarized in the thermoelectric figure of merit. A large figure of merit is beneficial for potential applications such as thermoelectric generators. Here we report the thermal and electronic properties of thin-film Heusler alloys based on Fe2V0.8W0.2Al prepared by magnetron sputtering. Density functional theory calculations suggest that the thin films are metastable states, and measurements of the power factor-the ratio of the Seebeck coefficient squared divided by the electrical resistivity-suggest a high intrinsic figure of merit for these thin films. This may arise from a large differential density of states at the Fermi level and a Weyl-like electron dispersion close to the Fermi level, which indicates a high mobility of charge carriers owing to linear crossing in the electronic bands.

A novel substrate for multisensor hyperspectral imaging.

The quality of chemical imaging, especially multisensor hyperspectral imaging, strongly depends on sample preparation techniques and instrumental infrastructure but also on the choice of an appropriate imaging substrate. To optimize the combined imaging of Raman microspectroscopy, scanning-electron microscopy and energy-dispersive X-ray spectroscopy, a novel substrate was developed based on sputtering of highly purified aluminium onto classical microscope slides. The novel aluminium substrate overcomes several disadvantages of classical substrates like impurities of the substrate material and contamination of the surface as well as surface roughness and homogeneity. Therefore, it provides excellent conditions for various hyperspectral imaging techniques and enables high-quality multisensor hyperspectral chemical imaging at submicron lateral resolutions.

Characterisation of sputter deposited niobium and boron interlayer in the copper-diamond system.

In most metal matrix composites (MMCs) interfaces are decisive but hard to manipulate. Especially copper-carbon composites can exhibit excellent mechanical and thermal properties only if the Cu/C interface is modified by an optimised interlayer. Due to the excellent thermal conductivity and mechanical stability of diamond this form of carbon is preferred as reinforcement in heat sink materials (copper-diamond composite) which are often subjected to severe thermal and mechanical loads. In the present case niobium and boron interlayers of various thicknesses were deposited on diamond and vitreous carbon substrates by magnetron sputter deposition. After the coverage of all samples by a copper film, a part of the samples was subjected to heat treatment for 30 min at 800 °C under high vacuum (HV) to simulate the thermal conditions during the production of the composite material by uniaxial hot pressing. De-wetting during heat treatment leads to the formation of holes or humps in the Cu coating. This effect was investigated by scanning electron microscopy (SEM) and atomic force microscopy (AFM). A comparison of time-of-flight secondary ion mass spectroscopy (TOF SIMS) profiles of heat treated samples with those of as deposited ones showed the influence of interdiffusion during the heating process. Diffusion behaviour and chemical composition of the interface were also studied by cross sectional transmission electron microscopy (X-TEM) investigations using focused ion beam (FIB) cut samples. The thermal contact resistance (TCR) of the interface was calculated from results obtained from modulated infrared radiometry (IR). Thin interlayers suppressed de-wetting most effectively and consequently the TCR at the Cu-diamond interface was found to decrease. Therefore they are promising candidates for optimising the Cu-diamond interface.

Characterization of the mechanical and thermal interface of copper films on carbon substrates modified by boron based interlayers.

The manipulation of mechanical and thermal interfaces is essential for the design of modern composites. Amongst these are copper carbon composites which can exhibit excellent heat conductivities if the Cu/C interface is affected by a suitable interlayer to minimize the Thermal Contact Resistance (TCR) and to maximize the adhesion strength between Cu and C.In this paper we report on the effect of boron based interlayers on wetting, mechanical adhesion and on the TCR of Cu coatings deposited on glassy carbon substrates by magnetron sputtering. The interlayers were 5 nm thick and consisted of pure B and B with additions of the carbide forming metals Mo, Ti and Cr in the range of 5 at.% relative to B. The interlayers were deposited by RF magnetron sputtering from either a pure B target or from a composite target. The interlayer composition was checked by Auger Electron Spectroscopy and found to be homogenous within the whole film.The system C-substrate/interlayer/Cu coating was characterized in as deposited samples and samples heat treated for 30 min at 800 °C under High Vacuum (HV), which mimics typical hot pressing parameters during composite formation. Material transport during heat treatment was investigated by Secondary Ion Mass Spectroscopy (SIMS). The de-wetting and hole formation in the Cu coating upon heat treatment were studied by Scanning Electron Microscopy (SEM) and Atomic Force Microscopy (AFM). The adhesion of the Cu coating was evaluated by mechanical pull-off testing. The TCR was assessed by infrared photothermal radiometry (PTR). A correlation between the adhesion strength and the value of the TCR which was measured by PTR was determined for as deposited as well as for heat treated samples.

Characterisation of the interface of sputter-deposited copper coatings on nitrogen plasma-treated carbon substrates.

The adhesion of copper coatings to carbon substrates is very poor, because of lack of diffusion or reaction between the constituents. Because there is technological interest in enhancing the adhesion and improving the interface between copper and carbon, plasma treatment of the carbon substrate was employed in this study. For modification of the carbon surface a nitrogen plasma was used. It was confirmed by pull-off tests that the strength of adhesion of the copper coating can be improved by a factor of more than 10 by plasma pretreatment, even after treatment for a very short time (1 min). To obtain more information about the mechanisms of the processes occurring at the interface SIMS investigations were performed on samples which had been treated for different times (between 1 and 60 min). These measurements confirmed that nitrogen is located on the interface. With increasing pretreatment time the amount of nitrogen detected on the interface increased. Besides characterisation of as-deposited samples, another focus was to study the mechanisms of diffusion of nitrogen if the samples are heat treated at 500 degrees C.

Separation of pure elemental and oxygen influenced signal in ELNES.

The energy loss near edge structure (ELNES) of many elements is strongly influenced by the presence of oxygen or other elements at surfaces, grain boundaries, or in the bulk material. The presented investigation deals mainly with the influence of oxygen at the surface. A method for the separation of both, the pure bulk signal and the oxidized surface signal, was evaluated and tested on Al, Cu, Mg, and Si. A comparison of experimental data with ab initio bandstructure calculations and other proofs of the accuracy of ELNES separation are presented. Influences of error propagations were tested and are exemplarily given for Al and Si.