3D-printed facet-attached optical elements for beam shaping in optical phased arrays.

We demonstrate an optical phased-array equipped with a 3D-printed facet-attached element for shaping and deflection of the emitted beam. The beam shaper combines freeform refractive surfaces with total-internal-reflection mirrors and is in-situ printed to edge-emitting waveguide facets using high-resolution multi-photon lithography, thereby ensuring precise alignment with respect to on-chip waveguide structures. In a proof-of-concept experiment, we achieve a grating-lobe free steering range of ±30∘ and a full-width-half-maximum beam divergence of approximately 2∘. The concept opens an attractive alternative to currently used grating structures and is applicable to a wide range of integration platforms.

3D-printed facet-attached optical elements for connecting VCSEL and photodiodes to fiber arrays and multi-core fibers.

Multicore optical fibers and ribbons based on fiber arrays allow for massively parallel transmission of signals via spatially separated channels, thereby offering attractive bandwidth scaling with linearly increasing technical effort. However, low-loss coupling of light between fiber arrays or multicore fibers and standard linear arrays of vertical-cavity surface-emitting lasers (VCSEL) or photodiodes (PD) still represents a challenge. In this paper, we demonstrate that 3D-printed facet-attached microlenses (FaML) offer an attractive path for connecting multimode fiber arrays as well as individual cores of multimode multicore fibers to standard arrays of VCSEL or PD. The freeform coupling elements are printed in situ with high precision on the device and fiber facets by high-resolution multi-photon lithography. We demonstrate coupling losses down to 0.35 dB along with lateral 1 dB alignment tolerances in excess of 10 µm, allowing to leverage fast passive assembly techniques that rely on industry-standard machine vision. To the best of our knowledge, our experiments represent the first demonstration of a coupling interface that connects individual cores of a multicore fiber to VCSEL or PD arranged in a standard linear array without the need for additional fiber-based or waveguide-based fan-out structures. Using this approach, we build a 3 × 25 Gbit/s transceiver assembly which fits into a small form-factor pluggable module and which fulfills many performance metrics specified in the IEEE 802.3 standard.

Transformation-optics modeling of 3D-printed freeform waveguides.

Multi-photon lithography allows us to complement planar photonic integrated circuits (PIC) by in-situ 3D-printed freeform waveguide structures. However, design and optimization of such freeform waveguides using time-domain Maxwell's equations solvers often requires comparatively large computational volumes, within which the structure of interest only occupies a small fraction, thus leading to poor computational efficiency. In this paper, we present a solver-independent transformation-optics-(TO-) based technique that allows to greatly reduce the computational effort related to modeling of 3D freeform waveguides. The concept relies on transforming freeform waveguides with curved trajectories into equivalent waveguide structures with modified material properties but geometrically straight trajectories, that can be efficiently fit into rather small cuboid-shaped computational volumes. We demonstrate the viability of the technique and benchmark its performance using a series of different freeform waveguides, achieving a reduction of the simulation time by a factor of 3-6 with a significant potential for further improvement. We also fabricate and experimentally test the simulated waveguides by 3D-printing on a silicon photonic chip, and we find good agreement between the simulated and the measured transmission at λ = 1550 nm.

Ultra-fast optical ranging using quantum-dash mode-locked laser diodes.

Laser-based light detection and ranging (LiDAR) is key to many applications in science and industry. For many use cases, compactness and power efficiency are key, especially in high-volume applications such as industrial sensing, navigation of autonomous objects, or digitization of 3D scenes using hand-held devices. In this context, comb-based ranging systems are of particular interest, combining high accuracy with high measurement speed. However, the technical complexity of miniaturized comb sources is still prohibitive for many applications, in particular when high optical output powers and high efficiency are required. Here we show that quantum-dash mode-locked laser diodes (QD-MLLD) offer a particularly attractive route towards high-performance chip-scale ranging systems. QD-MLLDs are compact, can be easily operated by a simple DC drive current, and provide spectrally flat frequency combs with bandwidths in excess of 2 THz, thus lending themselves to coherent dual-comb ranging. In our experiments, we show measurement rates of up to 500 MHz-the highest rate demonstrated with any ranging system so far. We attain reliable measurement results with optical return powers of only - 40 dBm, corresponding to a total loss of 49 dB in the ranging path, which corresponds to the highest loss tolerance demonstrated so far for dual-comb ranging with chip-scale comb sources. Combing QD-MLLDs with advanced silicon photonic receivers offers an attractive route towards robust and technically simple chip-scale LiDAR systems.

Superconducting nanowire single-photon detector with 3D-printed free-form microlenses.

We present an approach to increase the effective light-receiving area of superconducting nanowire single-photon detectors (SNSPD) by free-form microlenses. These lenses are printed in situ on top of the sensitive detector areas using high-resolution multi-photon lithography. We demonstrate a detector based on niobium-nitride (NbN) nanowires with a 4.5 µm × 4.5 µm sensitive area, supplemented with a lens of 60-µm-diameter. For a plane-wave-like free-space illumination at a wavelength of 1550 nm, the lensed sensor has a 100-fold increased effective collection area, which leads to a strongly enhanced system detection efficiency without the need for long nanowires. Our approach can be readily applied to a wide range of sensor types. It effectively overcomes the inherent design conflict between high count rate, high timing accuracy, and high fabrication yield on the one hand and high collection efficiency through a large effective detection area on the other hand.

Hybrid external-cavity lasers (ECL) using photonic wire bonds as coupling elements.

Combining semiconductor optical amplifiers (SOA) on direct-bandgap III-V substrates with low-loss silicon or silicon-nitride photonic integrated circuits (PIC) has been key to chip-scale external-cavity lasers (ECL) that offer wideband tunability along with small optical linewidths. However, fabrication of such devices still relies on technologically demanding monolithic integration of heterogeneous material systems or requires costly high-precision package-level assembly, often based on active alignment, to achieve low-loss coupling between the SOA and the external feedback circuits. In this paper, we demonstrate a novel class of hybrid ECL that overcome these limitations by exploiting 3D-printed photonic wire bonds as intra-cavity coupling elements. Photonic wire bonds can be written in-situ in a fully automated process with shapes adapted to the mode-field sizes and the positions of the chips at both ends, thereby providing low-loss coupling even in presence of limited placement accuracy. In a proof-of-concept experiment, we use an InP-based reflective SOA (RSOA) along with a silicon photonic external feedback circuit and demonstrate a single-mode tuning range from 1515 to 1565 nm along with side mode suppression ratios above 40 dB and intrinsic linewidths down to 105 kHz. Our approach combines the scalability advantages of monolithic integration with the performance and flexibility of hybrid multi-chip assemblies and may thus open a path towards integrated ECL on a wide variety of integration platforms.

Biophotonic sensors with integrated Si3N4-organic hybrid (SiNOH) lasers for point-of-care diagnostics.

Early and efficient disease diagnosis with low-cost point-of-care devices is gaining importance for personalized medicine and public health protection. Within this context, waveguide-(WG)-based optical biosensors on the silicon-nitride (Si3N4) platform represent a particularly promising option, offering highly sensitive detection of indicative biomarkers in multiplexed sensor arrays operated by light in the visible-wavelength range. However, while passive Si3N4-based photonic circuits lend themselves to highly scalable mass production, the integration of low-cost light sources remains a challenge. In this paper, we demonstrate optical biosensors that combine Si3N4 sensor circuits with hybrid on-chip organic lasers. These Si3N4-organic hybrid (SiNOH) lasers rely on a dye-doped cladding material that are deposited on top of a passive WG and that are optically pumped by an external light source. Fabrication of the devices is simple: The underlying Si3N4 WGs are structured in a single lithography step, and the organic gain medium is subsequently applied by dispensing, spin-coating, or ink-jet printing processes. A highly parallel read-out of the optical sensor signals is accomplished with a simple camera. In our proof-of-concept experiment, we demonstrate the viability of the approach by detecting different concentrations of fibrinogen in phosphate-buffered saline solutions with a sensor-length (L-)-related sensitivity of S/L = 0.16 rad nM-1 mm-1. To our knowledge, this is the first demonstration of an integrated optical circuit driven by a co-integrated low-cost organic light source. We expect that the versatility of the device concept, the simple operation principle, and the compatibility with cost-efficient mass production will make the concept a highly attractive option for applications in biophotonics and point-of-care diagnostics.

3D-printed optical probes for wafer-level testing of photonic integrated circuits.

Wafer-level probing of photonic integrated circuits is key to reliable process control and efficient performance assessment in advanced production workflows. In recent years, optical probing of surface-coupled devices such as vertical-cavity lasers, top-illuminated photodiodes, or silicon photonic circuits with surface-emitting grating couplers has seen great progress. In contrast to that, wafer-level probing of edge-emitting devices with hard-to-access vertical facets at the sidewalls of deep-etched dicing trenches still represents a major challenge. In this paper, we address this challenge by introducing a novel concept of optical probes based on 3D-printed freeform coupling elements that fit into deep-etched dicing trenches on the wafer surface. Exploiting the design freedom and the precision of two-photon laser lithography, the coupling elements can be adapted to a wide variety of mode-field sizes. We experimentally demonstrate the viability of the approach by coupling light to edge-emitting waveguides on different integration platforms such as silicon photonics (SiP), silicon nitride (TriPleX), and indium phosphide (InP). Achieving losses down to 1.9 dB per coupling interface, we believe that 3D-printed coupling elements represent a key step towards highly reproducible wafer-level testing of edge-coupled photonic integrated circuits.

Silicon-organic hybrid (SOH) Mach-Zehnder modulators for 100 GBd PAM4 signaling with sub-1†dB phase-shifter loss.

We report on compact and efficient silicon-organic hybrid (SOH) Mach-Zehnder modulators (MZM) with low phase-shifter insertion loss of 0.7 dB. The 280 µm-long phase shifters feature a π-voltage-length product of 0.41 Vmm and a loss-efficiency product as small as aUπL = 1.0 VdB. The device performance is demonstrated in a data transmission experiment, where we generate on-off-keying (OOK) and four-level pulse-amplitude modulation (PAM4) signals at symbol rates of 100 GBd, resulting in line rates of up to 200 Gbit/s. Bit error ratios are below the threshold for hard-decision forward error correction (HD-FEC) with 7% coding overhead, leading to net data rates of 187 Gbit/s. This is the highest PAM4 data rate ever achieved for a sub-1 mm silicon photonic MZM.

32QAM WDM transmission at 12 Tbit/s using a quantum-dash mode-locked laser diode (QD-MLLD) with external-cavity feedback.

Chip-scale frequency comb generators lend themselves as multi-wavelength light sources in highly scalable wavelength-division multiplexing (WDM) transmitters and coherent receivers. Among different options, quantum-dash (QD) mode-locked laser diodes (MLLD) stand out due to their compactness and simple operation along with the ability to provide a flat and broadband comb spectrum with dozens of equally spaced optical tones. However, the devices suffer from strong phase noise, which impairs transmission performance of coherent links, in particular when higher-order modulation formats are to be used. Here we exploit coherent feedback from an external cavity to drastically reduce the phase noise of QD-MLLD tones, thereby greatly improving the transmission performance. In our experiments, we demonstrate 32QAM WDM transmission on 60 carriers derived from a single QD-MLLD, leading to an aggregate line rate (net data rate) of 12 Tbit/s (11.215 Tbit/s) at a net spectral efficiency (SE) of 7.5 bit/s/Hz. To the best of our knowledge, this is the first time that a QD-MLLD optical frequency comb has been used to transmit an optical 32QAM signal. Based on our experimental findings, we perform simulations that show that feedback-stabilized QD-MLLD should also support 64QAM transmission with a performance close to the theoretical optimum across a wide range of technically relevant symbol rates.

Performance of chip-scale optical frequency comb generators in coherent WDM communications.

Optical frequency combs have the potential to become key building blocks of wavelength-division multiplexing (WDM) communication systems. The strictly equidistant narrow-band spectral lines of a frequency comb can serve either as carriers for parallel WDM transmission or as local-oscillator (LO) tones for parallel coherent reception. When it comes to highly scalable WDM transceivers with compact form factor, chip-sale comb sources are of particular interest, and recent experiments have demonstrated the viability of such devices for high-speed communications with line rates of tens of Tbit/s. However, the output power of chip-scale comb sources is generally lower than that of their conventional discrete-element counterparts, thus requiring additional amplifiers and impairing the optical signal-to-noise ratio (OSNR). In this paper, we investigate the influence of the power and optical carrier-to-noise ratio (OCNR) of the comb lines on the performance of the WDM link. We identify two distinctively different regimes, where the transmission performance is either limited by the comb source or by the link and the associated in-line amplifiers. We further investigate the impact of line-to-line power variations on the achievable OSNR and link capacity using a soliton Kerr frequency comb as a particularly interesting example. We believe that our findings will help to compare different comb generator types and to benchmark them with respect to the achievable transmission performance.

Verified equivalent-circuit model for slot-waveguide modulators.

We formulate and experimentally validate an equivalent-circuit model based on distributed elements to describe the electric and electro-optic (EO) properties of travelling-wave silicon-organic hybrid (SOH) slot-waveguide modulators. The model allows to reliably predict the small-signal EO frequency response of the modulators exploiting purely electrical measurements of the frequency-dependent RF transmission characteristics. We experimentally verify the validity of our model, and we formulate design guidelines for an optimum trade-off between optical loss due to free-carrier absorption (FCA), electro-optic bandwidth, and π-voltage of SOH slot-waveguide modulators.

Hybrid multi-chip assembly of optical communication engines by in situ 3D nano-lithography.

Three-dimensional (3D) nano-printing of freeform optical waveguides, also referred to as photonic wire bonding, allows for efficient coupling between photonic chips and can greatly simplify optical system assembly. As a key advantage, the shape and the trajectory of photonic wire bonds can be adapted to the mode-field profiles and the positions of the chips, thereby offering an attractive alternative to conventional optical assembly techniques that rely on technically complex and costly high-precision alignment. However, while the fundamental advantages of the photonic wire bonding concept have been shown in proof-of-concept experiments, it has so far been unclear whether the technique can also be leveraged for practically relevant use cases with stringent reproducibility and reliability requirements. In this paper, we demonstrate optical communication engines that rely on photonic wire bonding for connecting arrays of silicon photonic modulators to InP lasers and single-mode fibres. In a first experiment, we show an eight-channel transmitter offering an aggregate line rate of 448 Gbit/s by low-complexity intensity modulation. A second experiment is dedicated to a four-channel coherent transmitter, operating at a net data rate of 732.7 Gbit/s - a record for coherent silicon photonic transmitters with co-packaged lasers. Using dedicated test chips, we further demonstrate automated mass production of photonic wire bonds with insertion losses of (0.7 ± 0.15) dB, and we show their resilience in environmental-stability tests and at high optical power. These results might form the basis for simplified assembly of advanced photonic multi-chip systems that combine the distinct advantages of different integration platforms.

Lasing in Si3N4-organic hybrid (SiNOH) waveguides.

Silicon nitride (Si3N4) waveguides offer low-loss wave propagation over a wide spectral range including visible wavelengths and lend themselves to photonic integrated circuits for bio-photonic applications. The Si3N4 device portfolio, however, is so far limited to passive devices that need to be fed by external light sources. This often requires delicate and costly fiber-chip coupling schemes that are subject to stringent alignment tolerances. In this paper, we present and investigate a class of lasers that combine Si3N4 waveguides with light-emitting organic cladding materials in a hybrid approach. These Si3N4-organic hybrid (SiNOH) lasers are operated by optical pumping from the top with low alignment precision. We theoretically and experimentally investigate different SiNOH laser concepts based on spiral-shaped ring resonators and distributed feedback (DFB) resonators. While our devices are designed for an emission wavelength of approximately 600 nm, the SiNOH laser concept can be transferred to a large range of wavelengths in the visible spectrum. The devices are amenable to cost-efficient mass production and have the potential to address a wide range of applications in bio-photonics and point-of-care diagnostics.

3D-Printed Scanning-Probe Microscopes with Integrated Optical Actuation and Read-Out.

Scanning-probe microscopy (SPM) is the method of choice for high-resolution imaging of surfaces in science and industry. However, SPM systems are still considered as rather complex and costly scientific instruments, realized by delicate combinations of microscopic cantilevers, nanoscopic tips, and macroscopic read-out units that require high-precision alignment prior to use. This study introduces a concept of ultra-compact SPM engines that combine cantilevers, tips, and a wide variety of actuator and read-out elements into one single monolithic structure. The devices are fabricated by multiphoton laser lithography as it is a particularly flexible and accurate additive nanofabrication technique. The resulting SPM engines are operated by optical actuation and read-out without manual alignment of individual components. The viability of the concept is demonstrated in a series of experiments that range from atomic-force microscopy engines offering atomic step height resolution, their operation in fluids, and to 3D printed scanning near-field optical microscopy. The presented approach is amenable to wafer-scale mass fabrication of SPM arrays and capable to unlock a wide range of novel applications that are inaccessible by current approaches to build SPMs.

Comb-based WDM transmission at 10 Tbit/s using a DC-driven quantum-dash mode-locked laser diode.

Chip-scale frequency comb generators have the potential to become key building blocks of compact wavelength-division multiplexing (WDM) transceivers in future metropolitan or campus-area networks. Among the various comb generator concepts, quantum-dash (QD) mode-locked laser diodes (MLLD) stand out as a particularly promising option, combining small footprint with simple operation by a DC current and offering flat broadband comb spectra. However, the data transmission performance achieved with QD-MLLD was so far limited by strong phase noise of the individual comb tones, restricting experiments to rather simple modulation formats such as quadrature phase shift keying (QPSK) or requiring hardware-based compensation schemes. Here we demonstrate that these limitations can be overcome by digital symbol-wise blind phase search (BPS) techniques, avoiding any hardware-based phase-noise compensation. We demonstrate 16QAM dual-polarization WDM transmission on 38 channels at an aggregate net data rate of 10.68 Tbit/s over 75 km of standard single-mode fiber. To the best of our knowledge, this corresponds to the highest data rate achieved through a DC-driven chip-scale comb generator without any hardware-based phase-noise reduction schemes.

Coherent WDM transmission using quantum-dash mode-locked laser diodes as multi-wavelength source and local oscillator.

Quantum-dash (QD) mode-locked laser diodes (MLLD) lend themselves as chip-scale frequency comb generators for highly scalable wavelength-division multiplexing (WDM) links in future data-center, campus-area, or metropolitan networks. Driven by a simple DC current, the devices generate flat broadband frequency combs, containing tens of equidistant optical tones with line spacings of tens of GHz. Here we show that QD-MLLDs can not only be used as multi-wavelength light sources at a WDM transmitter, but also as multi-wavelength local oscillators (LO) for parallel coherent reception. In our experiments, we demonstrate transmission of an aggregate net data rate of 3.9 Tbit/s (23 × 45 GBd PDM-QPSK, 7% FEC overhead) over 75 km standard single-mode fiber (SSMF). To the best of our knowledge, this represents the first demonstration of a coherent WDM link that relies on QD-MLLD both at the transmitter and the receiver.

Photonic-integrated circuits with non-planar topologies realized by 3D-printed waveguide overpasses.

Complex photonic-integrated circuits (PIC) may have strongly non-planar topologies that require waveguide crossings (WGX) when realized in single-layer integration platforms. The number of WGX increases rapidly with the complexity of the circuit, in particular when it comes to highly interconnected optical switch topologies. Here, we present a concept for WGX-free PIC that relies on 3D-printed freeform waveguide overpasses (WOP). We experimentally demonstrate the viability of our approach using the example of a 4 × 4 switch-and-select (SAS) circuit realized on the silicon photonic platform. We further present a comprehensive graph-theoretical analysis of different n × n SAS circuit topologies. We find that for increasing port counts n of the SAS circuit, the number of WGX increases with n4, whereas the number of WOP increases only in proportion to n2.

Demonstration of long-term thermally stable silicon-organic hybrid modulators at 85 °C.

We report on the first demonstration of long-term thermally stable silicon-organic hybrid (SOH) modulators in accordance with Telcordia standards for high-temperature storage. The devices rely on an organic electro-optic sidechain polymer with a high glass transition temperature of 172 °C. In our high-temperature storage experiments at 85 °C, we find that the electro-optic activity converges to a constant long-term stable level after an initial decay. If we consider a burn-in time of 300 h, the π-voltage of the modulators increases on average by less than 15% if we store the devices for an additional 2400 h. The performance of the devices is demonstrated by generating high-quality 40 Gbit/s OOK signals both after the burn-in period and after extended high-temperature storage.

Surface sensing with integrated optical waveguides: a design guideline.

Waveguide-based biochemical sensors exploit detection of target molecules that bind specifically to a functionalized waveguide surface. For optimum sensitivity, the waveguide should be designed to mediate maximum influence of the surface layer on the effective refractive index of the guided mode. In this paper, we define a surface sensitivity metric which quantifies this impact and which allows to broadly compare different waveguide types and integration platforms. Focusing on silicon nitride and silicon-on-insulator (SOI) as the most common material systems, we systematically analyze and optimize a variety of waveguide types, comprising simple strips, slot and double slot structures, as well as sub-wavelength gratings (SWG). Comparing the highest achievable surface sensitivities, we provide universal design guidelines and physically interpret the observed trends and limitations. Our findings allow to select the appropriate WG platform and to optimize sensitivity for a given measurement task.