InAsSb Photodiode Fibre Optic Thermometry for High-Speed, near-Ambient Temperature Measurements.

Infrared radiation thermometers (IRTs) overcome many of the limitations of thermocouples, particularly responsiveness and calibration drift. The main challenge with radiation thermometry is the fast and reliable measurement of temperatures close to room temperature. A new IRT which is sensitive to wavelengths between 3 µm and 11 µm was developed and tested in a laboratory setting. It is based on an uncooled indium arsenide antimony (InAsSb) photodiode, a transimpedance amplifier, and a silver halogenide fibre optic cable transmissive in the mid- to long-wave infrared region. The prototype IRT was capable of measuring temperatures between 35 °C and 100 °C at an integration time of 5 ms and a temperature range between 40 °C and 100 °C at an integration time of 1 ms, with a root mean square (RMS) noise level of less than 0.5 °C. The thermometer was calibrated against Planck's law using a five-point calibration, leading to a measurement uncertainty within ±1.5 °C over the aforementioned temperature range. The thermometer was tested against a thermocouple during drilling operations of polyether ether ketone (PEEK) plastic to measure the temperature of the drill bit during the material removal process. Future versions of the thermometer are intended to be used as a thermocouple replacement in high-speed, near-ambient temperature measurement applications, such as electric motor condition monitoring; battery protection; and machining of polymers and composite materials, such as carbon-fibre-reinforced plastic (CFRP).

Aerosol jet printing polymer dispersed liquid crystals on highly curved optical surfaces and edges.

We demonstrate a new technique for producing Polymer Dispersed Liquid Crystal (PDLC) devices utilising aerosol jet printing (AJP). PDLCs require two substrates to act as scaffold for the Indium Tin Oxide electrodes, which restricts the device geometries. Our approach precludes the requirement for the second substrate by printing the electrode directly onto the surface of the PDLC, which is also printed. The process has the potential to be precursory to the implementation of non-contact printing techniques for a variety of liquid crystal-based devices on non-planar substrates. We report the demonstration of direct deposition of PDLC films onto non-planar optical surfaces, including a functional device printed over the 90° edge of a prism. Scanning Electron Microscopy is used to inspect surface features of the polymer electrodes and the liquid crystal domains in the host polymer. The minimum relaxation time of the PDLC was measured at 1.3 ms with an 800 Hz, 90 V, peak-to-peak (Vpp) applied AC field. Cross-polarised transmission is reduced by up to a factor of 3.9. A transparent/scattering contrast ratio of 1.4 is reported between 0 and 140 V at 100 Hz.

High-Speed Infrared Radiation Thermometer for the Investigation of Early Stage Explosive Development and Fireball Expansion.

The understanding of blast loads is critical for the development of infrastructure that protects against explosions. However, the lack of high-quality experimental work on the characterisation of such loads prevents a better understanding of many scenarios. Blast loads are typically characterised by use of some form of pressure gauge, from which the temperature can be inferred from a pressure measurement. However, such an approach to temperature measurement is limited; it assumes ideal gas laws apply throughout, which may not be the case for high temperature and pressure scenarios. In contrast, infrared radiation thermometers (IRTs) perform a measurement of temperature based upon the emitted radiance from the target object. The IRTs can measure fast changes in transient temperature, making them seemingly ideal for the measurement of a fireball's temperature. In this work, we present the use of a high-speed IRT for the measurement of early-stage explosive development and fireball expansion within a confined blast, with the temperature of the explosive fireball measured from its emitted radiance. The temperature measured by the IRT was corroborated against the temperature inferred from a pressure gauge measurement; both instruments measured the same temperature from the quasi-static pressure (QSP) point onwards. Before the QSP point, it is deduced that the IRT measures the average temperature of the fireball over a wide field-of-view (FOV), as opposed to that inferred from the singular shocks detected by the pressure gauge. Therefore, use of an IRT, in tandem with a pressure gauge, provides a potential invaluable measurement technique for the characterisation the early stages of a fireball as it develops and expands.

High-Resolution Hyperspectral Imaging Using Low-Cost Components: Application within Environmental Monitoring Scenarios.

High-resolution hyperspectral imaging is becoming indispensable, enabling the precise detection of spectral variations across complex, spatially intricate targets. However, despite these significant benefits, currently available high-resolution set-ups are typically prohibitively expensive, significantly limiting their user base and accessibility. These limitations can have wider implications, limiting data collection opportunities, and therefore our knowledge, across a wide range of environments. In this article we introduce a low-cost alternative to the currently available instrumentation. This instrument provides hyperspectral datasets capable of resolving spectral variations in mm-scale targets, that cannot typically be resolved with many existing low-cost hyperspectral imaging alternatives. Instrument metrology is provided, and its efficacy is demonstrated within a mineralogy-based environmental monitoring application highlighting it as a valuable addition to the field of low-cost hyperspectral imaging.

Low-Cost Hyperspectral Imaging with A Smartphone.

Recent advances in smartphone technologies have opened the door to the development of accessible, highly portable sensing tools capable of accurate and reliable data collection in a range of environmental settings. In this article, we introduce a low-cost smartphone-based hyperspectral imaging system that can convert a standard smartphone camera into a visible wavelength hyperspectral sensor for ca. £100. To the best of our knowledge, this represents the first smartphone capable of hyperspectral data collection without the need for extensive post processing. The Hyperspectral Smartphone's abilities are tested in a variety of environmental applications and its capabilities directly compared to the laboratory-based analogue from our previous research, as well as the wider existing literature. The Hyperspectral Smartphone is capable of accurate, laboratory- and field-based hyperspectral data collection, demonstrating the significant promise of both this device and smartphone-based hyperspectral imaging as a whole.

Low-Cost Hyperspectral Imaging System: Design and Testing for Laboratory-Based Environmental Applications.

The recent surge in the development of low-cost, miniaturised technologies provides a significant opportunity to develop miniaturised hyperspectral imagers at a fraction of the cost of currently available commercial set-ups. This article introduces a low-cost laboratory-based hyperspectral imager developed using commercially available components. The imager is capable of quantitative and qualitative hyperspectral measurements, and it was tested in a variety of laboratory-based environmental applications where it demonstrated its ability to collect data that correlates well with existing datasets. In its current format, the imager is an accurate laboratory measurement tool, with significant potential for ongoing future developments. It represents an initial development in accessible hyperspectral technologies, providing a robust basis for future improvements.

Quantitative traceable temperature measurement using novel thermal imaging camera.

Conventional thermal imaging cameras, based on focal-plane array (FPA) sensors, exhibit inherent problems: such as stray radiation, cross-talk and the calibration uncertainty of ensuring each pixel behaves as if it were an identical temperature sensor. Radiation thermometers can largely overcome these issues, comprising of only a single detector element that can be optimised and calibrated. Although the latter approach can provide excellent accuracy for single-point temperature measurement, it does not provide a temperature image of the target object. In this work, we present a micromechanical systems (MEMS) mirror and silicon (Si) avalanche photodiode (APD) based single-pixel camera, capable of producing quantitative thermal images at an operating wavelength of 1 µm. This work utilises a custom designed f-theta wide-angle lens and MEMS mirror, to scan +/- 30° in both x- and y-dimensions, without signal loss due to vignetting at any point in the field of view (FOV). Our single-pixel camera is shown to perform well, with 3 °C size-of-source effect (SSE) related temperature error and can measure below 700 °C whilst achieving ± 0.5 °C noise related measurement uncertainty. Our measurements were calibrated and traceable to the International Temperature Scale of 1990 (ITS-90). The combination of low SSE and absence of vignetting enables quantitative temperature measurements over a spatial field with measurement uncertainty at levels lower than would be possible with FPA based thermal imaging cameras.

Miniature Uncooled and Unchopped Fiber Optic Infrared Thermometer for Application to Cutting Tool Temperature Measurement.

A new infrared thermometer, sensitive to wavelengths between 3 µm and 3.5 µm, has been developed. It is based on an Indium Arsenide Antimony (InAsSb) photodiode, a transimpedance amplifier, and a sapphire fiber optic cable. The thermometer used an uncooled photodiode sensor and received infrared radiation that did not undergo any form of optical chopping, thereby, minimizing the physical size of the device and affording its attachment to a milling machine tool holder. The thermometer is intended for applications requiring that the electronics are located remotely from high-temperature conditions incurred during machining but also affording the potential for use in other harsh conditions. Other example applications include: processes involving chemical reactions and abrasion or fluids that would otherwise present problems for invasive contact sensors to achieve reliable and accurate measurements. The prototype thermometer was capable of measuring temperatures between 200 °C and 1000 °C with sapphire fiber optic cable coupling to high temperature conditions. Future versions of the device will afford temperature measurements on a milling machine cutting tool and could substitute for the standard method of embedding thermocouple wires into the cutting tool inserts. Similarly, other objects within harsh conditions could be measured using these techniques and accelerate developments of the thermometer to suit particular applications.

Quantitative thermal imaging using single-pixel Si APD and MEMS mirror.

Accurate quantitative temperature measurements are difficult to achieve using focal-plane array sensors. This is due to reflections inside the instrument and the difficulty of calibrating a matrix of pixels as identical radiation thermometers. Size-of-source effect (SSE), which is the dependence of an infrared temperature measurement on the area surrounding the target area, is a major contributor to this problem and cannot be reduced using glare stops. Measurements are affected by power received from outside the field-of-view (FOV), leading to increased measurement uncertainty. In this work, we present a micromechanical systems (MEMS) mirror based scanning thermal imaging camera with reduced measurement uncertainty compared to focal-plane array based systems. We demonstrate our flexible imaging approach using a Si avalanche photodiode (APD), which utilises high internal gain to enable the measurement of lower target temperatures with an effective wavelength of 1 µm and compare results with a Si photodiode. We compare measurements from our APD thermal imaging instrument against a commercial bolometer based focal-plane array camera. Our scanning approach results in a reduction in SSE related temperature error by 66 °C for the measurement of a spatially uniform 800 °C target when the target aperture diameter is increased from 10 to 20 mm. We also find that our APD instrument is capable of measuring target temperatures below 700 °C, over these near infrared wavelengths, with D* related measurement uncertainty of ± 0.5 °C.

Design and realization of a wide field of view infrared scanning system with an integrated micro-electromechanical system mirror.

We present a wide field of view (FOV) infrared scanning system, designed for single-pixel near-infrared thermal imaging. The scanning system consisted of a two-axis micro-electromechanical system (MEMS) mirror that was incorporated within the lens. The optical system consisted of two groups of lenses and a silicon avalanche photodiode. The system was designed for both the production of thermal images and also to utilize the techniques of radiation thermometry to measure the absolute temperature of targets from 500°C to 1100°C. Our system has the potential for real-time image acquisition, with improved data acquisition electronics. The FOV of our scanning system was ±30° when fully utilizing the MEMS mirror's scanning angle of ±5°. The pixel FOV (calculated from the distance to target size ratio) was 100:1. The image quality was analyzed, including the modulation transfer function, spot diagrams, ray fan plots, lateral chromatic aberrations, distortion, relative illumination, and size-of-source effect. The instrument was fabricated in our laboratory, and one of the thermal images, which was taken with the new lens, is presented as an example of the instrument optical performance.