Effect of Secondary Phase on Electroless Ni Plating Behaviour of Super Duplex Stainless Steel SAF2507 for Advanced Li-Ion Battery Case.

The development of Li-ion battery cases requires superior electrical conductivity, strength, and corrosion resistance for both cathode and anode to enhance safety and performance. Among the various battery case materials, super duplex stainless steel (SDSS), which is composed of austenite and ferrite as two-phase stainless steel, exhibits outstanding strength and corrosion resistance. However, stainless steel, which is an iron-based material, tends to have lower electrical conductivity. Nevertheless, nickel-plating SDSS can achieve excellent electrical conductivity, making it suitable for Li-ion battery cases. Therefore, this study analysed the plating behaviour of SDSS plates after nickel plating to leverage their exceptional strength and corrosion resistance. Electroless Ni plating was performed to analyse the plating behaviour, and the plating behaviour was studied with reference to different plating durations. Heat treatment was conducted at 1000 °C for one hour, followed by cooling at 50 °C/s. Post-heat treatment, the analysis of phases was executed using FE-SEM, EDS, and EPMA. Electroless Ni plating was performed at 60-300 s. The plating duration after the heat treatment was up to 300 s, and the behaviour of the materials was observed using FE-SEM. The phase analysis concerning different plating durations was conducted using XRD. Post-heat treatment, the precipitated secondary phases in SAF2507 were identified as Sigma, Chi, and CrN, approximating a 13% distribution. During the electroless Ni plating, the secondary phase exhibited a plating rate equivalent to that of ferrite, entirely plating at around 180 s. Further increments in plating time displayed growth of the plating layer from the austenite direction towards the ferrite, accompanied by a reduced influence from the substrate. Despite the differences in composition, both the secondary phase and austenite demonstrated comparable plating rates, showing that electroless Ni plating on SDSS was primarily influenced by the substrate, a finding which was primarily confirmed through phase analysis.

Process Optimization for Manufacturing Functional Nanosurfaces by Roll-to-Roll Nanoimprint Lithography.

Roll-to-roll nanoimprint lithography (RTR-NIL) is a low-cost and continuous fabrication process for large-area functional films. However, the partial ultraviolet (UV) resin filling obstructs the ongoing production process. This study incorporates UV resin filling process into the nanopillars and nanopores by using RTR-NIL. A multiphase numerical model with a sliding mesh method is proposed in this study to show the actual phenomena of imprint mold rotation and feeding of UV resin on the polyethylene terephthalate (PET) substrate. The implementation of UV resin filling under environmental conditions was performed by utilizing the open-channel (OC) boundary conditions. The numerical model was solved by using the explicit volume of fluid (VOF) scheme to compute the filling on each node of the computational domain. The effects of different processing parameters were investigated through the proposed numerical model such as imprinting speed (IS), contact angles (CAs), viscosity, initial thickness of the PET, and supporting roll diameter. A good agreement was found between numerical simulations and experimental results. The proposed numerical model gives better insights of the filling process for the mass production of functional surfaces with nanopillars and nanopores patterns for different applications on an industrial scale.

Nanofabrication Techniques: Challenges and Future Prospects.

Nanofabrication of functional micro/nano-features is becoming increasingly relevant in various electronic, photonic, energy, and biological devices globally. The development of these devices with special characteristics originates from the integration of low-cost and high-quality micro/nano-features into 3D-designs. Great progress has been achieved in recent years for the fabrication of micro/nanostructured based devices by using different imprinting techniques. The key problems are designing techniques/approaches with adequate resolution and consistency with specific materials. By considering optical device fabrication on the large-scale as a context, we discussed the considerations involved in product fabrication processes compatibility, the feature's functionality, and capability of bottom-up and top-down processes. This review summarizes the recent developments in these areas with an emphasis on established techniques for the micro/nano-fabrication of 3-dimensional structured devices on large-scale. Moreover, numerous potential applications and innovative products based on the large-scale are also demonstrated. Finally, prospects, challenges, and future directions for device fabrication are addressed precisely.

Diverging Effects of Topographical Continuity on the Wettability of a Rough Surface.

The effects of the continuity of the surface pattern on wetting enhancement was investigated using micropillar and microhole arrays on hydrophilic and hydrophobic materials. Isolated micropillar arrays and continuous microhole arrays were prepared by a microscale imprinting technique using positive and negative Si molds fabricated by a conventional photolithography technique. The contact angles (CAs) and contact angle hysteresis (CAH) of the prepared surfaces were measured as a function of the surface parameter ξ, defined as the ratio of the top surface area of the microstructure to the surface area of the flat unit cell. It was found that the CAs of the micropillar array monotonically increased as the surface ratio decreased, regardless of the native wettability of the solid. However, an abnormal and consistent decrease of the CAs for the microhole array was observed when ξ < 0.5. To investigate the mechanism of this abnormality in wetting enhancement, the energy barriers for normal direction wetting, the so-called wetting transition from Cassi-Baxter (CB) wetting to Wenzel wetting, and lateral direction wetting, that is, spreading, were investigated with consideration of the trapped air in the microhole. The analysis unveiled that the hydrophobicity of the hydrophilic surfaces are attributable to the liquid-air interface pinning at the discontinuous edge of the pillar, which results in CB wetting. The abnormal decrease in the CAs of the microhole-patterned surfaces with ξ < 0.5 has been attributed to the relatively low energy barrier for spreading influenced by the continuity of the three-phase contact line. Additionally, trapped air in the microhole also plays a role in the spreading of water droplets by hindering the wetting transition from CB wetting to Wenzel wetting.

Improved oxygen diffusion barrier properties of ruthenium-titanium nitride thin films prepared by plasma-enhanced atomic layer deposition.

Ru-TiN thin films were prepared from bis(ethylcyclopentadienyl)ruthenium and tetrakis(dimethylamino)titanium using plasma-enhanced atomic layer deposition (PEALD). The Ru and TiN were deposited sequentially to intermix TiN with Ru. The composition of Ru-TiN films was controlled precisely by changing the number of deposition cycles allocated to Ru, while fixing the number of deposition cycles allocated to TiN. Although both Ru and TiN thin films have a polycrystalline structure, the microstructure of the Ru-TiN films changed from a TiN-like polycrystalline structure to a nanocrystalline on increasing the Ru intermixing ratio. Moreover, the electrical resistivity of the Ru0.67-TiN0.33 thin films is sufficiently low at 190 microomega x cm and was maintained even after O2 annealing at 750 degrees C. Therefore, Ru-TiN thin films can be utilized as a oxygen diffusion barrier material for future dynamic (DRAM) and ferroelectric (FeRAM) random access memory capacitors.

Size measurement of nanoparticles using atomic force microscopy.

This chapter outlines procedures for sample preparation and the determination of nanoparticle size using atomic force microscopy (AFM). Several procedures for dispersing gold nanoparticles on various surfaces such that they are suitable for imaging and height measurement via intermittent contact mode, or tapping mode, AFM are first described. The methods for AFM calibration and operation to make such measurements are then discussed. Finally, the techniques for data analysis and reporting are provided. The nanoparticles cited are National Institute of Standards and Technology (NIST) Au nanoparticle Reference Materials RM 8011 (nominally 10 nm particles), RM 8012 (nominally 30 nm), and RM 8013 (nominally 60 nm).

Origin of adhesion in humid air.

The origin of adhesion in humid air is investigated by pull-off force measurements between nanoscale contacts using atomic force microscopes in controlled environments from ultrahigh vacuum through various humidity conditions to water. An equivalent work of adhesion (WOA) model with a simplified interface stress distribution is developed, combining the effects of screened van der Waals and meniscus forces, which describes adhesion in humid air and which self-consistently treats the contact stress and deformation. Although the pull-off force is found to vary significantly with humidity, the equivalent WOA is found to be invariant. Increasing humidity alters the nature of the surface adhesion from a compliant contact with a localized, intense meniscus force to a stiff contact with an extended, weak meniscus force.