A Methodology for Robust Multislice Ptychography.

While multislice electron ptychography can provide thermal vibration limited resolution and structural information in 3D, it relies on properly selecting many intertwined acquisition and computational parameters. Here, we outline a methodology for selecting acquisition parameters to enable robust ptychographic reconstructions. We develop two physically informed metrics, areal oversampling and Ronchigram magnification, to describe the selection of these parameters in multislice ptychography. Through simulations, we comprehensively evaluate the validity of these two metrics over a broad range of conditions and show that they accurately guide reconstruction success. Further, we validate these conclusions with experimental ptychographic data and demonstrate close agreement between trends in simulated and experimental data. Using these metrics, we achieve experimental multislice reconstructions at a scan step of 2.1Å/px, enabling large field-of-view, data-efficient reconstructions. These experimental design principles enable the routine and robust use of multislice ptychography for 3D characterization of materials at the atomic scale.

Clamping enables enhanced electromechanical responses in antiferroelectric thin films.

Thin-film materials with large electromechanical responses are fundamental enablers of next-generation micro-/nano-electromechanical applications. Conventional electromechanical materials (for example, ferroelectrics and relaxors), however, exhibit severely degraded responses when scaled down to submicrometre-thick films due to substrate constraints (clamping). This limitation is overcome, and substantial electromechanical responses in antiferroelectric thin films are achieved through an unconventional coupling of the field-induced antiferroelectric-to-ferroelectric phase transition and the substrate constraints. A detilting of the oxygen octahedra and lattice-volume expansion in all dimensions are observed commensurate with the phase transition using operando electron microscopy, such that the in-plane clamping further enhances the out-of-plane expansion, as rationalized using first-principles calculations. In turn, a non-traditional thickness scaling is realized wherein an electromechanical strain (1.7%) is produced from a model antiferroelectric PbZrO3 film that is just 100 nm thick. The high performance and understanding of the mechanism provide a promising pathway to develop high-performance micro-/nano-electromechanical systems.

Modeling Temperature-Dependent Electron Thermal Diffuse Scattering via Machine-Learned Interatomic Potentials and Path-Integral Molecular Dynamics.

Electron thermal diffuse scattering is shown to be sensitive to subtle changes in atomic vibrations and shows promise in assessing lattice dynamics at nanometer resolution. Here, we demonstrate that machine-learned interatomic potentials (MLIPs) and path-integral molecular dynamics can accurately capture the potential energy landscape and lattice dynamics needed to describe electron thermal diffuse scattering. Using SrTiO_{3} as a test bed at cryogenic and room temperatures, we compare electron thermal diffuse scattering simulations using different approximations to incorporate thermal motion. Only when the simulations are based on quantum mechanically accurate MLIPs in combination with path-integral molecular dynamics that include nuclear quantum effects is there excellent agreement with experiments.