RESUMEN
Two-dimensional topological insulators have attracted much interest due to their potential applications in spintronics and quantum computing. To access the exotic physical phenomena, a gate electric field is required to tune the Fermi level into the bulk band gap. Hexagonal boron nitride (h-BN) is a promising alternative gate dielectric due to its unique advantages such as flat and charge-free surface. Here we present a h-BN/graphite van der Waals heterostructure as a top gate on HgTe heterostructure-based Hall bar devices. We compare our results to devices with h-BN/Ti/Au and HfO2/Ti/Au gates. Devices with a h-BN/graphite gate show no charge carrier density shift compared to as-grown structures, in contrast to a significant n-type carrier density increase for HfO2/Ti/Au. We attribute this observation mainly to the comparable work function of HgTe and graphite. In addition, devices with h-BN gate dielectric show slightly higher electron mobility compared to HfO2-based devices. Our results demonstrate the compatibility between layered materials transfer and wet-etched structures and provide a strategy to solve the issue of significant shifts of the carrier density in gated HgTe heterostructures.
RESUMEN
We utilize a diffusion-controlled wet chemical etching technique to fabricate microstructures from two-dimensional HgTe/(Hg,Cd)Te-based topological insulators. For this purpose, we employ a KI: I2: HBr: H2O-based etchant. Investigation of the side profile of the etched heterostructure reveals that HgTe quantum wells protrude from the layer stack as a result of the different etch rates of the layers. This constraint poses challenges for the study of the transport properties of edge channels in HgTe quantum wells. In order to achieve a smoother side profile, we develop a novel approach to the etching process involving the incorporation of a sacrificial design element in the etch mask. This limits the flow of charge carriers to the ions in the electrolyte during the etching process. The simplicity of the method coupled with the promising results achieved thereby should make it possible for the new approach introduced here to be applied to other semiconductor heterostructures.
RESUMEN
Advanced data encryption requires the use of true random number generators (TRNGs) to produce unpredictable sequences of bits. TRNG circuits with high degree of randomness and low power consumption may be fabricated by using the random telegraph noise (RTN) current signals produced by polarized metal/insulator/metal (MIM) devices as entropy source. However, the RTN signals produced by MIM devices made of traditional insulators, i.e., transition metal oxides like HfO2 and Al2 O3 , are not stable enough due to the formation and lateral expansion of defect clusters, resulting in undesired current fluctuations and the disappearance of the RTN effect. Here, the fabrication of highly stable TRNG circuits with low power consumption, high degree of randomness (even for a long string of 224 - 1 bits), and high throughput of 1 Mbit s-1 by using MIM devices made of multilayer hexagonal boron nitride (h-BN) is shown. Their application is also demonstrated to produce one-time passwords, which is ideal for the internet-of-everything. The superior stability of the h-BN-based TRNG is related to the presence of few-atoms-wide defects embedded within the layered and crystalline structure of the h-BN stack, which produces a confinement effect that avoids their lateral expansion and results in stable operation.
RESUMEN
Two-dimensional (2D) material-based memristors have shown several properties that are not shown by traditional ones, such as high transparency, robust mechanical strength and flexibility, superb chemical stability, enhanced thermal heat dissipation, ultralow power consumption, coexistence of bipolar and threshold resistive switching, and ultrastable relaxation when used as electronic synapse (among others). However, several electrical performances often required in memristive applications, such as the generation of multiple stable resistive states for high-density information storage, still have never been demonstrated. Here, we present the first 2D material-based memristors that exhibit three stable and well-distinguishable resistive states. By using a multilayer hexagonal boron nitride (h-BN) stack sandwiched by multilayer graphene (G) electrodes, we fabricate 5 µm × 5 µm cross-point Au/Ti/G/h-BN/G/Au memristors that can switch between each two or three resistive states, depending on the current limitation (CL) and reset voltage used. The use of graphene electrodes plus a small cross-point structure are key elements to observe the tristate operation, which has not been observed in larger (100 µm × 100 µm) devices with an identical Au/Ti/G/h-BN/G/Au structure nor in similar small (5 µm × 5 µm) devices without graphene interfacial layers (i.e., Au/Ti/h-BN/Au). Basically, we generate an intermediate state between the high resistive state and the low resistive state (LRS), named soft-LRS (S-LRS), which may be related to the formation of a narrower conductive nanofilament across the h-BN because of the ability of graphene to limit metal penetration (at low CLs). All the 2D materials have been fabricated using the scalable chemical vapor deposition approach, which is an immediate advantage compared to other works using mechanical exfoliated 2D materials.
