Piezoelectric polymer multilayer on flexible substrate for energy harvesting.

A piezoelectric polymer multilayer structure formed on a flexible substrate is investigated for mechanical energy harvesting under bending mode. Analytical and numerical models are developed to clarify the effect of material parameters critical to the energy harvesting performance of the bending multilayer structure. It is shown that the maximum power is proportional to the square of the piezoelectric stress coefficient and the inverse of dielectric permittivity of the piezoelectric polymer. It is further found that a piezoelectric multilayer with thinner electrodes can generate more electric energy in bending mode. The effect of improved impedance matching in the multilayer polymer on energy output is remarkable. Comparisons between piezoelectric ceramic multilayers and polymer multilayers on flexible substrate are discussed. The fabrication of a P(VDF-TrFE) multilayer structure with a thin Al electrode layer is experimentally demonstrated by a scalable dip-coating process on a flexible aluminum substrate. The results indicate that it is feasible to produce a piezoelectric polymer multilayer structure on flexible substrate for harvesting mechanical energy applicable for many low-power electronics.

Miniaturized acceleration sensors with in-plane polarized piezoelectric thin films produced by micromachining.

Miniaturized acceleration sensors employing piezoelectric thin films were fabricated through batch micromachining with silicon and silicon-on-insulator (SOI) wafers. The acceleration sensors comprised multiple suspension beams supporting a central seismic mass. Ferroelectric (Pb,La)(Zr,Ti) O(3) (PLZT) thin films were coated and in-plane polarized on the surfaces of the suspension beams for realizing electromechanical conversion through the piezoelectric effect. Interdigital electrodes were formed on the PLZT films and connected in parallel. Finite element analyses were conducted for the stress and strain distributions, providing guidance to the structural design, including optimizing electrode positioning for collecting the electrical output constructively. Uniformity of the beam thickness and sample consistency were significantly improved by using SOI wafers instead of silicon wafers. The measurement results showed that all the sensor samples had fundamental resonances of symmetric out-of-plane vibration mode at frequencies in the range of 8 to 35 kHz, depending on the sample dimensions. These sensors exhibited stable electrical outputs in response to acceleration input, achieving a high signal-to-noise ratio without any external amplifier or signal conditioning.