The Influence of Laser Process Parameters on the Adhesion Strength between Electroless Copper and Carbon Fiber Composites Determined Using Response Surface Methodology.

Laser process technology provides a feasible method for directly manufacturing surface-metallized carbon fiber composites (CFCs); however, the laser's process parameters strongly influence on the adhesion strength between electroless copper and CFCs. Here, a nanosecond ultraviolet laser was used to fabricate electroless copper on the surface of CFCs. In order to achieve good adhesion strength, four key process parameters, namely, the laser power, scanning line interval, scanning speed, and pulse frequency, were optimized experimentally using response surface methodology, and a central composite design was utilized to design the experiments. An analysis of variance was conducted to evaluate the adequacy and significance of the developed regression model. Also, the effect of the process parameters on the adhesion strength was determined. The numerical analysis indicated that the optimized laser power, scanning line interval, scanning speed, and pulse frequency were 5.5 W, 48.2 µm, 834.0 mm/s, and 69.5 kHz, respectively. A validation test confirmed that the predicted results were consistent with the actual values; thus, the developed mathematical model can adequately predict responses within the limits of the laser process parameters being used.

Bifunctional Interface Passivation via Copper Acetylacetonate for Efficient and Stable Perovskite Solar Cells.

Manipulating interface defects can minimize interfacial nonradiative recombination, thus increasing the stability and performance of perovskite solar cells (PSCs). Here, copper acetylacetonate [Cu(acac)2] as a passivator is used to treat the interface between Spiro-OMeTAD and perovskite. Owing to the strong chelation, the uncoordinated Pb2+ could react with -C═O/-COH functional groups, firmly anchoring acetylacetonate at this interface or the grain boundaries (GBs) of perovskite films to construct multiple ligand bridges, accompanied by the p-type copper iodide formation with copper substituting lead. Simultaneously, Cu+-Cu2+ pairs transfer electrons from Pb0 to I0, suppressing deep level defects of Pb0 and I0 near the perovskite interface. These can be beneficial to hole-transferring. Moreover, the Schiff base complexes with hydrophobicity, from the reaction of acetylacetonate with perovskite, can lead to tightly packed adjacent perovskite surfaces and self-seal the GBs of the perovskite, inhibiting moisture diffusion for long-term stability. Consequently, the Cu(acac)2-based PSC has achieved more than 24% champion efficiency while retaining ca. 92% of the initial power conversion efficiency after 1680 h of storage.

Improving the curing and flame retardancy of epoxy resin composites by multifunctional Si-containing cyclophosphazene derivatives.

Novel star-like molecules containing P, N and Si with dual functions of flame retardance and curing promotion (abridged as HCCP-KH540) were successfully synthesized through the nucleophilic substitution reaction of hexachlorocyclotriphosphazene (HCCP) and 3-aminopropyltrimethoxysilane (KH540). HCCP-KH540 was incorporated with the matrix of epoxy resin (EP) to form a flame retardant composite abridged as E-HK. The activation energy of the curing reaction of the E-HK composite was reduced but the curing reaction rate was accelerated by HCCP-KH540. The E-HK composite with 30 phr content of HCCP-KH540 exhibited excellent flame retardancy with limiting oxygen index of 29.6% and V-1 rating in the vertical burning test as well as excellent thermal stability with a char yield of 23.77% at 700 °C, compared with only 8.64% for pure EP.

Porous Ultrahigh Molecular Weight Polyethylene/Functionalized Activated Nanocarbon Composites with Improved Biocompatibility.

Ultrahigh molecular weight polyethylene (UHMWPE) materials have been prevalent joint replacement materials for more than 45 years because of their excellent biocompatibility and wear resistance. In this study, functionalized activated nanocarbon (FANC) was prepared by grafting maleic anhydride polyethylene onto acid-treated activated nanocarbon. A novel porous UHMWPE composite was prepared by incorporating the appropriate amount of FANC and pore-forming agents during the hot-pressing process for medical UHMWPE powder. The experimental results showed that the best prepared porous UHMWPE/FANC exhibited appropriate tensile strength, porosity, and excellent hydrophilicity, with a contact angle of 65.9°. In vitro experiments showed that the porous UHMWPE/FANC had excellent biocompatibility, which is due to its porous structure and hydrophilicity caused by FANC. This study demonstrates the potential viability for our porous UHMWPE/FANC to be used as cartilage replacement material for biomedical applications.

Laser direct-writing lithography equipment system for rapid and µm-precision fabrication on curved surfaces with large sag heights.

A novel laser direct writing lithography equipment system was proposed to realize rapid and µm-precision fabrication on curved surfaces with large curvatures and large sag heights. Through detailed design, analysis, simulation, and measurement, it showed that the system was able to continuously, linearly and rapidly change the focus position in z coordinate. For demonstration, a concentric-circular photoresist grating with a sag height of 5.2 mm and a designed line width/space of 12.5 µm/25 µm was fabricated within 40 s on a convex K9 glass substrate surface with a curvature radius of 32.77 mm. When combining with the movement of the x-y-z stage, the system could fabricate the micropatterns on curved surfaces with larger dimensions. Further, the system possessed the general principles of optics, mechanics, and automation for µm-precision 3D microfabrication.