Laboratory study of PCB transport from primary sources to settled dust.

Dust is an important sink for indoor air pollutants, such as polychlorinated biphenyls (PCBs) that were used in building materials and products. In this study, two types of dust, house dust and Arizona Test Dust, were tested in a 30-m(3) stainless steel chamber with two types of panels. The PCB-containing panels were aluminum sheets coated with a PCB-spiked primer or caulk. The PCB-free panels were coated with the same materials but without PCBs. The dust evenly spread on each panel was collected at different times to determine its PCB content. The data from the PCB panels were used to evaluate the PCB migration from the source to the dust through direct contact, and the data from the PCB-free panels were used to evaluate the sorption of PCBs through the dust/air partition. Settled dust can adsorb PCBs from air. The sorption concentration was dependent on the congener concentration in the air and favored less volatile congeners. When the house dust was in direct contact with the PCB-containing panel, PCBs migrated into the dust at a much faster rate than the PCB transfer rate due to the dust/air partition. The dust/source partition was not significantly affected by the congener's volatility. For a given congener, the ratio between its concentration in the dust and in the source was used to estimate the dust/source partition coefficient. The estimated values ranged from 0.04 to 0.16. These values are indicative of the sink strength of the tested house dust being in the middle or lower-middle range.

Chamber study of PCB emissions from caulking materials and light ballasts.

The emissions of polychlorinated biphenyl (PCB) congeners from thirteen caulk samples were tested in a micro-chamber system. Twelve samples were from PCB-contaminated buildings and one was prepared in the laboratory. Nineteen light ballasts collected from buildings that represent 13 different models from five manufacturers were tested in 53-L environmental chambers. The rates of PCB congener emissions from caulking materials and light ballasts were determined. Several factors that may have affected the emission rates were evaluated. The experimentally determined emission factors showed that, for a given PCB congener, there is a linear correlation between the emission factor and the concentration of the PCB congener in the source. Furthermore, the test results showed that an excellent log-linear correlation exists between the normalized emission factor and the vapor pressure (coefficient of determination, r(2)⩾0.8846). The PCB congener emissions from ballasts at or near room temperature were relatively low with or without electrical load. However, the PCB congener emission rates increased significantly as the temperature increased. The results of this research provide new data and models for ranking the primary sources of PCBs and supports the development and refinement of exposure assessment models for PCBs.