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1.
Polymers (Basel) ; 13(20)2021 Oct 10.
Artículo en Inglés | MEDLINE | ID: mdl-34685231

RESUMEN

Despite recent successes in incorporating lignin into photoactive resins, lignin photo-properties can be detrimental to its application in UV-curable photopolymers, especially in specialized engineered resins for use in stereolithography printing. We report on chemical modification techniques employed to reduce UV absorption by lignin and the resulting mechanical, thermal, and cure properties of these modified lignin materials. Lignin was modified using reduction and acylation reactions and incorporated into a 3D printable resin formulation. UV-Vis absorption at the 3D printing range of 405 nm was reduced in all modified lignins compared to the unmodified sample by 25% to ≥ 60%. Resins made with the modified lignins showed an increase in stiffness and strength with lower thermal stability. Studying these techniques is an important step in developing lignin for use in UV-curing applications and further the effort to valorize lignin towards commercial use.

2.
ACS Appl Mater Interfaces ; 10(42): 36456-36463, 2018 Oct 24.
Artículo en Inglés | MEDLINE | ID: mdl-30256091

RESUMEN

Generating compatible and competitive materials that are environmentally sustainable and economically viable is paramount for the success of additive manufacturing using renewable materials. We report the successful application of renewable, modified lignin-containing photopolymer resins in a commercial stereolithography system. Resins were fabricated within operable ranges for viscosity and cure properties, using up to 15% modified lignin by weight. A 4-fold increase in ductility in cured parts with higher lignin concentration is noted compared to commercial stereolithography resins. Excellent print quality was seen in modified lignin resins, with good layer fusion, high surface definition, and visual clarity. These materials can be used to generate new products for additive manufacturing applications and help fill vacant material property spaces, where ductility, sustainability, and application costs are critical.

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