1.
J Surf Eng Mater Adv Technol
; 5(4): 207-213, 2015 Oct.
Artículo
en Inglés
| MEDLINE
| ID: mdl-27042384
RESUMEN
Filling high-aspect-ratio trenches with gold is a frequent requirement in the fabrication of x-ray optics as well as micro-electronic components and other fabrication processes. Conformal electrodeposition of gold in sub-micron-width silicon trenches with an aspect ratio greater than 35 over a grating area of several square centimeters is challenging and has not been described in the literature previously. A comparison of pulsed plating and constant current plating led to a gold electroplating protocol that reliably filled trenches for such structures.