Submicron Memtransistors Made from Monocrystalline Molybdenum Disulfide.

Multiterminal memtransistors made from two-dimensional (2D) materials have garnered increasing attention in the pursuit of low-power heterosynaptic neuromorphic circuits. However, existing 2D memtransistors tend to necessitate high set voltages (>1 V) or feature defective channels, posing concerns regarding material integrity and intrinsic properties. Herein, we present a monocrystalline monolayer MoS2 memtransistor designed for operation within submicron regimes. Under reverse drain bias sweeps, our experiments reveal memristive behavior within the device, further controllable through modulation of the gate terminal. This controllability facilitates the consistent manifestation of multistate memory effects. Notably, the memtransistor behavior becomes more significant as the channel length diminishes, particularly with channel lengths below 1.6 µm, showcasing an increase in the switching ratio alongside a decrease in the set voltage with the decreasing channel length. Our optimized memtransistor demonstrates the ability to exhibit individual resistance states spanning 5 orders of magnitude, with switching drain voltages of approximately 0.05 V. To elucidate these findings, we investigate hot carrier effects and their interplay with oxide traps within the HfO2 dielectric. This work highlights the importance of memtransisor behavior in highly scaled 2D transistors, particularly those featuring low contact resistances. This understanding holds the potential to tailor memory characteristics essential for the development of energy-efficient neuromorphic devices.

Defect-engineered room temperature negative differential resistance in monolayer MoS2 transistors.

The negative differential resistance (NDR) effect has been widely investigated for the development of various electronic devices. Apart from traditional semiconductor-based devices, two-dimensional (2D) transition metal dichalcogenide (TMD)-based field-effect transistors (FETs) have also recently exhibited NDR behavior in several of their heterostructures. However, to observe NDR in the form of monolayer MoS2, theoretical prediction has revealed that the material should be more profoundly affected by sulfur (S) vacancy defects. In this work, monolayer MoS2 FETs with a specific amount of S-vacancy defects are fabricated using three approaches, namely chemical treatment (KOH solution), physical treatment (electron beam bombardment), and as-grown MoS2. Based on systematic studies on the correlation of the S-vacancies with both the device's electron transport characteristics and spectroscopic analysis, the NDR has been clearly observed in the defect-engineered monolayer MoS2 FETs with an S-vacancy (VS) amount of ∼5 ± 0.5%. Consequently, stable NDR behavior can be observed at room temperature, and its peak-to-valley ratio can also be effectively modulated via the gate electric field and light intensity. Through these results, it is envisioned that more electronic applications based on defect-engineered layered TMDs will emerge in the near future.

Twisted Light-Induced Photocurrent in a Silicon Nanowire Field-Effect Transistor.

Light can possess orbital angular momentum (OAM), in addition to spin angular momentum (SAM), which offers nearly infinite possible values of momentum states, allowing a wider degree of freedom for information processing and communications. The OAM of light induces a selection rule that obeys the law of conservation of angular momentum as it interacts with a material, affecting the material's optical and electrical properties. In this work, silicon nanowire field-effect transistors are subjected to light with OAM, also known as twisted light. Electrical measurements on the devices consequently reveal photocurrent enhancements after incrementing the OAM of the incident light from 0ℏ (fundamental mode) to 5ℏ. Such a phenomenon is attributed to the enhancements of the photogating and the photoconductive effects under the influence of the OAM of light, the underlying mechanism of which is proposed and discussed using energy band diagrams. With these observations, a strategy for controlling photocurrent has been introduced, which can be a realization of the application in the field of optoelectronics technology.

Organic-Inorganic Solid-State Hybridization with High-Strength and Anti-Hydrolysis Interface.

Organic-inorganic material hybridization at the solid-state level is indispensable for the integration of IoT applications, but still remains a challenging issue. Existing bonding strategies in the field of electronic packaging tend to employ vacuum or ultrahigh temperature; however, these can cause process complications and material deterioration. Here we report an easy-to-tune method to achieve hybrid bonding at the solid-state level and under the ambient atmosphere. Vacuum-ultraviolet (VUV)-induced reorganization with ethanol was used to develop hydroxyl-carrying alkyl chains through coordinatively-bonded carboxylate onto aluminum, whereas numerous hydroxyl-carrying alkyls were created on polyimide. The triggering of dehydration through these hydroxyls by merely heating at 150 °C for a few minutes produced robust organic-inorganic reticulated complexes within the aluminum/polyimide interface. The as-bonded aluminum/polyimide interface possessed an superior fracture energy of (2.40 ± 0.36) × 103 (J/m2) compared with aluminum and polyimide matrices themselves, which was mainly attributed to crack deflection due to the nano-grains of inorganic-organic reticulated complexes. The interfacial adhesion was successfully kept after humidity test, which was contributed by those anti-hydrolytic carboxylates. To the best of our knowledge, for the first time organic-inorganic bonding at the solid-state level was achieved using the ethanol-assisted VUV (E-VUV) process, a strategy which should be applicable to a diversity of plastics and metals with native oxides.