RESUMO
The design of non-buckling interconnects with thick sections has gained important applications in stretchable inorganic electronics due to their simultaneous achievement of high stretchability, low resistance, and low heat generation. However, at the same time, such a design sharply increased the tensile stiffness, which is detrimental to the conformal fit and skin comfort. Introducing the fractal design into the non-buckling interconnects is a promising approach to greatly reduce the tensile stiffness while maintaining other excellent performances. Here, a hierarchical theory is proposed for the tensile stiffness of the non-buckling fractal-inspired interconnects with an arbitrary shape at each order, which is verified by the finite element analysis. The results show that the tensile stiffness of the non-buckling fractal-inspired interconnects decreases with the increase in either the height/span ratio or the number of fractal orders but is not highly correlated with the ratio of the two adjacent dimensions. When the ratio of the two adjacent dimensions and height/span ratio are fixed, the tensile stiffness of the serpentine fractal-inspired interconnect is smaller than that of sinusoidal and zigzag fractal-inspired interconnects. These findings are of great significance for the design of non-buckling fractal-inspired interconnects of stretchable inorganic electronics.