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Dent Mater ; 37(8): 1316-1324, 2021 08.
Artigo em Inglês | MEDLINE | ID: mdl-34144794


OBJECTIVES: The purpose of the study was to evaluate the integrity of dentine type I collagen after self-etching (SE) treatments with strong and mild universal adhesives. METHODS: Coronal dentine specimens (n=10/product) were imaged by optical microscopy and analyzed by ATR-FTIR spectroscopy before and after treatment with 32% phosphoric acid gel (PA-negative control), 17% neutral EDTA (ED-positive control) conditioners and Adhese Universal (AD), Clearfil Universal Bond Quick (CQ), G-Premio Bond (GP), Prelude One (PR) and Scotchbond Universal (SB) adhesives. From the spectroscopic analysis the following parameters were determined: a) Extent of dentine demineralization (DM%) and b) percentage area of the Amide I curve-fitted components of ß-turns, 310-helix/ß-turns, α-helix, random coils, ß-sheets and collagen maturation (R) index. Statistical analysis was performed by one-way ANOVA (DM%), paired t-test/Wilcoxon test (Amide I components) and Spearman correlation coefficient (DM% vs Amide I components) at an a=0.05 level. RESULTS: PA, ED and GP removed the smear-layer and opened tubule orifices, whereas all other treatments removed only the intratubular smear-layer fraction. The ranking of the statistically significant differences in DM% was PA>GP>ED>AD, SB, CQ, PR, with AD being significantly different from PR. Regarding the Amide I components, PA demonstrated a significant reduction in ß-turns, α-helices and an increase in ß-sheets, GP a reduction in ß-turns, AD an increase in ß-turns and random coils, and CQ an increase in ß-turns. PR, SB and ED showed insignificant differences in all the Amide I components. Significant correlations were found between DM%-random coils and DM%-R. SIGNIFICANCE: The universal adhesives used in the SE mode induced none to minimal changes in dentine collagen structure, without evidence of the destabilization pattern observed after conventional phosphoric acid treatments.

Colagem Dentária , Adesivos Dentinários , Condicionamento Ácido do Dente , Colágeno , Cimentos Dentários , Dentina , Teste de Materiais , Cimentos de Resina , Propriedades de Superfície , Resistência à Tração
J Adhes Dent ; 20(2): 151-164, 2018.
Artigo em Inglês | MEDLINE | ID: mdl-29675514


PURPOSE: To evaluate the effects on the surface properties (morphology, roughness, microhardness, composition) and bond strength to composite of four types of base cements (Equia-Fil/EQF, Angelus white MTA/MTA, Biodentin/BDN and IRM/IRM) when treated with phosphoric acid etching (PAE) or two self-etch adhesives (Select One Prime & Bond and Clearfil S3 Bond). MATERIALS AND METHODS: Disk-shaped specimens were prepared and stored until complete setting. The surfaces before and after treatments were examined by stereomicroscopy, optical profilometry, ATR-FTIR, and LV-SEM/EDX. Interfacial bond strength with composite was evaluated under shear loading (SBS) using a conventional bonding resin (Heliobond) on silane treated (SIL) specimens as a reference. Failure mode was evaluated using stereomicroscopy. RESULTS: PAE induced compositional changes on MTA and BDN, forming a phosphate-rich surface layer, probably composed of Ca-P salts. Dissolution of the amorphous cement fractions was evident in all materials. SPB and CSB did not show remarkable changes apart from an increase in Si content on MTA. On all bases, PAE resulted in the highest values for most of the roughness parameters. SPB and CSB showed lower or equal average roughness (Sa) and percentage of additional surface area contributed by the texture (Sdr) compared to the control in MTA and EQL. In terms of SBS, the highest ß (Weibull shape parameter) in MPa were MTA-SIL = 5.79, BDN-PAE = 3.67, and MTA-PAE = 3.46, whereas the highest α (Weibull scale parameter) were EQF-CSB = 9.08, BDN-PAE = 5.13, and BDN-SIL = 4.67. Adhesive failures with less than 20% of the bonding area were encountered in IRM-PAE and SIL, EQF-CBS and MTA-SIL. CONCLUSION: Each base material requires a different procedure for optimal bonding with composite. Phosphoric acid etching and application of the conventional bonding resin Heliobond is the preferred procedure for composite bonding to MTA, BDN, IRM, but for composite bonding to CSB for EQF, the mild self-etch adhesive is preferable.

Condicionamento Ácido do Dente , Colagem Dentária , Resinas Compostas , Cimentos Dentários , Adesivos Dentinários , Teste de Materiais , Cimentos de Resina , Resistência ao Cisalhamento , Propriedades de Superfície