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Materials (Basel) ; 11(3)2018 Mar 01.
Artigo em Inglês | MEDLINE | ID: mdl-29494534


The light emitting diode (LED) is widely used in modern solid-state lighting applications, and its output efficiency is closely related to the submounts' material properties. Most submounts used today, such as low-power printed circuit boards (PCBs) or high-power metal core printed circuit boards (MCPCBs), are not transparent and seriously decrease the output light extraction. To meet the requirements of high light output and better color mixing, a three-dimensional (3-D) stacked flip-chip (FC) LED module is proposed and demonstrated. To realize light penetration and mixing, the mentioned 3-D vertically stacking RGB LEDs use transparent glass as FC package submounts called glass circuit boards (GCB). Light emitted from each GCB stacked LEDs passes through each other and thus exhibits good output efficiency and homogeneous light-mixing characteristics. In this work, the parasitic problem of heat accumulation, which caused by the poor thermal conductivity of GCB and leads to a serious decrease in output efficiency, is solved by a proposed transparent cooling oil encapsulation (OCP) method.

Sci Rep ; 8(1): 2452, 2018 02 05.
Artigo em Inglês | MEDLINE | ID: mdl-29403018


Increasing phosphor layer thickness and concentration can enhance the lumen flux of white LED (W-LED). In this work, we found that increasing the phosphor layer thickness and concentration can increase its temperature, and there is also a maximum thickness and concentration beyond which their increase will not lead to lumen increase, but only temperature increase. Higher thickness and higher concentration also results in warm light instead of White light. The maximum thickness and concentration are found to be limited by the scattering of light rays with higher % decrease of blue light rays than the yellow light rays. The results obtained in this work can also be used to compute the temperature and thermo-mechanical stress distribution of an encapsulated LED, demonstrating its usefulness to the design of encapsulated LED packages. Simulation software like ANSYS and TracePro are used extensively to verify the root cause mechanisms.

Sci Rep ; 6: 24052, 2016 Apr 07.
Artigo em Inglês | MEDLINE | ID: mdl-27052103


A moisture- electrical - temperature (MET) test is proposed to evaluate the outdoor reliability of high power blue LEDs, with and without phosphor, and to understand the degradation physics of LEDs under the environment of combined humidity, temperature and electrical stresses. The blue LEDs with phosphor will be the high power white LEDs. Scanning acoustic microscopy is used to examine the resulted delamination during this test for the LEDs. The degradation mechanisms of blue LEDs (LEDs without phosphor) and white LEDs (LEDs with phosphor) are found to be different, under both the power on (i.e. with 350 mA through each LED) and power off (i.e. without current supply) conditions. Difference in the coefficient of thermal expansion between the molding part and the lens material as well as the heat generated by the phosphor layer are found to account for the major differences in the degradation mechanisms observed. The findings indicate that the proposed MET test is necessary for the LED industry in evaluating the reliability of LEDs under practical outdoor usage environment.