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Electronic contribution in heat transfer at metal-semiconductor and metal silicide-semiconductor interfaces.
Hamaoui, Georges; Horny, Nicolas; Hua, Zilong; Zhu, Tianqi; Robillard, Jean-François; Fleming, Austin; Ban, Heng; Chirtoc, Mihai.
Affiliation
  • Hamaoui G; GRESPI, Multiscale Thermophysics Lab., Université de Reims Champagne-Ardenne URCA, Reims, France.
  • Horny N; GRESPI, Multiscale Thermophysics Lab., Université de Reims Champagne-Ardenne URCA, Reims, France. nicolas.horny@univ-reims.fr.
  • Hua Z; Mechanical Engineering and Materials Science department, University of Pittsburgh, Pittsburgh, PA, United States.
  • Zhu T; Univ. Lille, CNRS, Centrale Lille, ISEN, Univ. Valenciennes, UMR 8520 - IEMN, F-59000, Lille, France.
  • Robillard JF; Univ. Lille, CNRS, Centrale Lille, ISEN, Univ. Valenciennes, UMR 8520 - IEMN, F-59000, Lille, France.
  • Fleming A; GRESPI, Multiscale Thermophysics Lab., Université de Reims Champagne-Ardenne URCA, Reims, France.
  • Ban H; Mechanical Engineering and Materials Science department, University of Pittsburgh, Pittsburgh, PA, United States.
  • Chirtoc M; Mechanical Engineering and Materials Science department, University of Pittsburgh, Pittsburgh, PA, United States.
Sci Rep ; 8(1): 11352, 2018 Jul 27.
Article in En | MEDLINE | ID: mdl-30054516
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Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: Sci Rep Year: 2018 Document type: Article Affiliation country: Country of publication:
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Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: Sci Rep Year: 2018 Document type: Article Affiliation country: Country of publication: