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Reliability issues of lead-free solder joints in electronic devices.
Jiang, Nan; Zhang, Liang; Liu, Zhi-Quan; Sun, Lei; Long, Wei-Min; He, Peng; Xiong, Ming-Yue; Zhao, Meng.
Affiliation
  • Jiang N; School of Mechatronic Engineering, Jiangsu Normal University, Xuzhou, China.
  • Zhang L; School of Mechatronic Engineering, Jiangsu Normal University, Xuzhou, China.
  • Liu ZQ; State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, China.
  • Sun L; Institute of Metal Research, Chinese Academy of Sciences, Shenyang, China.
  • Long WM; National Key Laboratory of Science and Technology on Helicopter Transmission, Nanjing University of Aeronautics and Astronautics, Nanjing, China.
  • He P; State Key Laboratory of Advanced Brazing Filler Metals and Technology, Zhengzhou Research Institute of Mechanical Engineering, Zhengzhou, China.
  • Xiong MY; State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, China.
  • Zhao M; School of Mechatronic Engineering, Jiangsu Normal University, Xuzhou, China.
Sci Technol Adv Mater ; 20(1): 876-901, 2019.
Article in En | MEDLINE | ID: mdl-31528239
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Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: Sci Technol Adv Mater Year: 2019 Document type: Article Affiliation country: Country of publication:
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Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: Sci Technol Adv Mater Year: 2019 Document type: Article Affiliation country: Country of publication: