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Implementation of Flip-Chip Microbump Bonding between InP and SiC Substrates for Millimeter-Wave Applications.
Lee, Jongwon; Lee, Jae Yong; Song, Jonghyun; Sim, Gapseop; Ko, Hyoungho; Kong, Seong Ho.
Affiliation
  • Lee J; Nano Convergence Technology Division, National Nanofab Center, Daejeon 34141, Korea.
  • Lee JY; School of Electronic and Electrical Engineering, Kyungpook National University, Daegu 41566, Korea.
  • Song J; Nano Convergence Technology Division, National Nanofab Center, Daejeon 34141, Korea.
  • Sim G; Department of Electronics Engineering, Chungnam National University, Daejeon 34134, Korea.
  • Ko H; Nano Convergence Technology Division, National Nanofab Center, Daejeon 34141, Korea.
  • Kong SH; Department of Electronics Engineering, Chungnam National University, Daejeon 34134, Korea.
Micromachines (Basel) ; 13(7)2022 Jul 05.
Article in En | MEDLINE | ID: mdl-35888889
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Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: Micromachines (Basel) Year: 2022 Document type: Article Country of publication:
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Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: Micromachines (Basel) Year: 2022 Document type: Article Country of publication: