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High-Precision Wafer Bonding Alignment Mark Using Moiré Fringes and Digital Grating.
Fan, Jianhan; Lu, Sen; Zou, Jianxiao; Yang, Kaiming; Zhu, Yu; Liao, Kaiji.
Affiliation
  • Fan J; School of Automation Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China.
  • Lu S; State Key Laboratory of Tribology, Department of Mechanical Engineering, Tsinghua University, Beijing 100084, China.
  • Zou J; School of Automation Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China.
  • Yang K; Shenzhen Institute for Advance Study, University of Electronic Science and Technology of China, Shenzhen 518110, China.
  • Zhu Y; State Key Laboratory of Tribology, Department of Mechanical Engineering, Tsinghua University, Beijing 100084, China.
  • Liao K; State Key Laboratory of Tribology, Department of Mechanical Engineering, Tsinghua University, Beijing 100084, China.
Micromachines (Basel) ; 13(12)2022 Dec 07.
Article in En | MEDLINE | ID: mdl-36557458
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Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: Micromachines (Basel) Year: 2022 Document type: Article Affiliation country: Country of publication:
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Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: Micromachines (Basel) Year: 2022 Document type: Article Affiliation country: Country of publication: