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Biodegradable, three-dimensional colorimetric fliers for environmental monitoring.
Yoon, Hong-Joon; Lee, Geumbee; Kim, Jin-Tae; Yoo, Jae-Young; Luan, Haiwen; Cheng, Shyuan; Kang, Soohyeon; Huynh, Huong Le Thien; Kim, Hyeonsu; Park, Jaehong; Kim, Joohee; Kwak, Sung Soo; Ryu, Hanjun; Kim, Jihye; Choi, Yeon Sik; Ahn, Hak-Young; Choi, Junhwan; Oh, Seyong; Jung, Yei Hwan; Park, Minsu; Bai, Wubin; Huang, Yonggang; Chamorro, Leonardo P; Park, Yoonseok; Rogers, John A.
Affiliation
  • Yoon HJ; Department of Electronic Engineering, Gachon University, Seongnam-si, Gyeonggi-do 13120, Republic of Korea.
  • Lee G; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.
  • Kim JT; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.
  • Yoo JY; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.
  • Luan H; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.
  • Cheng S; Department of Mechanical Science and Engineering, University of Illinois, Urbana, IL 61801, USA.
  • Kang S; Department of Mechanical Science and Engineering, University of Illinois, Urbana, IL 61801, USA.
  • Huynh HLT; Department of Biomedical Engineering, Northwestern University, Evanston, IL 60208, USA.
  • Kim H; Department of Chemical and Biomolecular Engineering, University of Illinois, Urbana, IL 61801, USA.
  • Park J; Department of Chemical and Biomolecular Engineering, University of Illinois, Urbana, IL 61801, USA.
  • Kim J; Center for Bionics of Biomedical Research Institute, Korea Institute of Science and Technology, Seoul 02792, Republic of Korea.
  • Kwak SS; Center for Bionics of Biomedical Research Institute, Korea Institute of Science and Technology, Seoul 02792, Republic of Korea.
  • Ryu H; Department of Advanced Materials Engineering, Chung-Ang University, 4726 Seodong-daero, Daedeok-myeon, Anseong-si, Gyeonggi-do 17546, Republic of Korea.
  • Kim J; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.
  • Choi YS; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.
  • Ahn HY; Department of Materials Science and Engineering, Yonsei University 50 Yonsei-ro, Seodaemun-gu, Seoul 03722, Republic of Korea.
  • Choi J; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.
  • Oh S; Department of Chemical Engineering, Dankook University, Yongin 16890, Republic of Korea.
  • Jung YH; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.
  • Park M; Department of Electronic Engineering, Hanyang University, Seoul, Republic of Korea.
  • Bai W; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.
  • Huang Y; Department of Applied Physical Sciences, University of North Carolina at Chapel Hill, Chapel Hill, NC 27514, USA.
  • Chamorro LP; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.
  • Park Y; Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA.
  • Rogers JA; Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208, USA.
Sci Adv ; 8(51): eade3201, 2022 12 23.
Article in En | MEDLINE | ID: mdl-36563148
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Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: Sci Adv Year: 2022 Document type: Article
Fulltext
Add to My VHL
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Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: Sci Adv Year: 2022 Document type: Article