Your browser doesn't support javascript.
loading
Effectiveness of Dimple Microtextured Copper Substrate on Performance of Sn-0.7Cu Solder Alloy.
Roduan, Siti Faqihah; Wahab, Juyana A; Salleh, Mohd Arif Anuar Mohd; Mahayuddin, Nurul Aida Husna Mohd; Abdullah, Mohd Mustafa Al Bakri; Halil, Aiman Bin Mohd; Zaifuddin, Amira Qistina Syamimi; Muhammad, Mahadzir Ishak; Sandu, Andrei Victor; Baltatu, Madalina Simona; Vizureanu, Petrica.
Affiliation
  • Roduan SF; Faculty of Chemical Engineering and Technology, Kompleks Pusat Pengajian Jejawi 2, Universiti Malaysia Perlis (UniMAP), Arau 02600, Malaysia.
  • Wahab JA; Faculty of Chemical Engineering and Technology, Kompleks Pusat Pengajian Jejawi 2, Universiti Malaysia Perlis (UniMAP), Arau 02600, Malaysia.
  • Salleh MAAM; Faculty of Chemical Engineering and Technology, Kompleks Pusat Pengajian Jejawi 2, Universiti Malaysia Perlis (UniMAP), Arau 02600, Malaysia.
  • Mahayuddin NAHM; Geopolymer and Green Technology, Centre of Excellence (CEGeoGTech), Universiti Malaysia Perlis (UniMAP), Arau 02600, Malaysia.
  • Abdullah MMAB; Faculty of Chemical Engineering and Technology, Kompleks Pusat Pengajian Jejawi 2, Universiti Malaysia Perlis (UniMAP), Arau 02600, Malaysia.
  • Halil ABM; Faculty of Chemical Engineering and Technology, Kompleks Pusat Pengajian Jejawi 2, Universiti Malaysia Perlis (UniMAP), Arau 02600, Malaysia.
  • Zaifuddin AQS; Geopolymer and Green Technology, Centre of Excellence (CEGeoGTech), Universiti Malaysia Perlis (UniMAP), Arau 02600, Malaysia.
  • Muhammad MI; Faculty of Mechanical and Automotive Engineering Technology, Universiti Malaysia Pahang, Pekan 26600, Malaysia.
  • Sandu AV; Faculty of Mechanical and Automotive Engineering Technology, Universiti Malaysia Pahang, Pekan 26600, Malaysia.
  • Baltatu MS; Faculty of Mechanical and Automotive Engineering Technology, Universiti Malaysia Pahang, Pekan 26600, Malaysia.
  • Vizureanu P; Department of Technologies and Equipments for Materials Processing, Faculty of Materials Science and Engineering, Gheorghe Asachi Technical University of Iasi, Blvd. Mangeron, No. 51, 700050 Iasi, Romania.
Materials (Basel) ; 16(1)2022 Dec 22.
Article in En | MEDLINE | ID: mdl-36614433
Key words
Fulltext
Add to My VHL
Print
XML
PubMed Links
Search on Google

Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: Materials (Basel) Year: 2022 Document type: Article Affiliation country: Country of publication:
Fulltext
Add to My VHL
Print
XML
PubMed Links
Search on Google

Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: Materials (Basel) Year: 2022 Document type: Article Affiliation country: Country of publication: