Your browser doesn't support javascript.
loading
Microstructure and morphology of the soldering interface of Sn-2.0Ag-1.5Zn low Ag content lead-free solder ball and different substrates.
Xiao, Jin; Tong, Xing; Liang, Jinhui; Chen, Quankun; Tang, Qiming.
Affiliation
  • Xiao J; Department of Mechanical and Electrical Engineering, Guangzhou Huali College, Guangzhou 511300, China.
  • Tong X; Department of Mechanical and Electrical Engineering, Guangzhou Huali College, Guangzhou 511300, China.
  • Liang J; Department of Mechanical and Electrical Engineering, Guangzhou Huali College, Guangzhou 511300, China.
  • Chen Q; Department of Mechanical and Electrical Engineering, Guangzhou Huali College, Guangzhou 511300, China.
  • Tang Q; Department of Mechanical and Electrical Engineering, Guangzhou Huali College, Guangzhou 511300, China.
Heliyon ; 9(2): e12952, 2023 Feb.
Article in En | MEDLINE | ID: mdl-36747560
Key words
Fulltext
Add to My VHL
Print
XML
PubMed Links
Search on Google

Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: Heliyon Year: 2023 Document type: Article Affiliation country: Country of publication:
Fulltext
Add to My VHL
Print
XML
PubMed Links
Search on Google

Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: Heliyon Year: 2023 Document type: Article Affiliation country: Country of publication: