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Thermal Transport in Nanoelectronic Devices Cooled by On-Chip Magnetic Refrigeration.
Autti, S; Bettsworth, F C; Grigoras, K; Gunnarsson, D; Haley, R P; Jones, A T; Pashkin, Yu A; Prance, J R; Prunnila, M; Thompson, M D; Zmeev, D E.
Affiliation
  • Autti S; Department of Physics, Lancaster University, Lancaster, LA1 4YB, United Kingdom.
  • Bettsworth FC; Department of Physics, Lancaster University, Lancaster, LA1 4YB, United Kingdom.
  • Grigoras K; VTT Technical Research Centre of Finland Ltd, P.O. Box 1000, 02044 VTT, Espoo, Finland.
  • Gunnarsson D; VTT Technical Research Centre of Finland Ltd, P.O. Box 1000, 02044 VTT, Espoo, Finland.
  • Haley RP; Department of Physics, Lancaster University, Lancaster, LA1 4YB, United Kingdom.
  • Jones AT; Department of Physics, Lancaster University, Lancaster, LA1 4YB, United Kingdom.
  • Pashkin YA; Department of Physics, Lancaster University, Lancaster, LA1 4YB, United Kingdom.
  • Prance JR; Department of Physics, Lancaster University, Lancaster, LA1 4YB, United Kingdom.
  • Prunnila M; VTT Technical Research Centre of Finland Ltd, P.O. Box 1000, 02044 VTT, Espoo, Finland.
  • Thompson MD; Department of Physics, Lancaster University, Lancaster, LA1 4YB, United Kingdom.
  • Zmeev DE; Department of Physics, Lancaster University, Lancaster, LA1 4YB, United Kingdom.
Phys Rev Lett ; 131(7): 077001, 2023 Aug 18.
Article in En | MEDLINE | ID: mdl-37656858

Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: Phys Rev Lett Year: 2023 Document type: Article Affiliation country:

Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: Phys Rev Lett Year: 2023 Document type: Article Affiliation country: