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Note: Near infrared interferometric silicon wafer metrology.
Choi, M S; Park, H M; Joo, K N.
Affiliation
  • Choi MS; Department of Photonic Engineering, Chosun University, Gwangju 61452, South Korea.
  • Park HM; Department of Photonic Engineering, Chosun University, Gwangju 61452, South Korea.
  • Joo KN; Department of Photonic Engineering, Chosun University, Gwangju 61452, South Korea.
Rev Sci Instrum ; 87(4): 046106, 2016 04.
Article in En | MEDLINE | ID: mdl-27131722
ABSTRACT
In this investigation, two near infrared (NIR) interferometric techniques for silicon wafer metrology are described and verified with experimental results. Based on the transparent characteristic of NIR light to a silicon wafer, the fiber based spectrally resolved interferometry can measure the optical thickness of the wafer and stitching low coherence scanning interferometry can reconstruct entire surfaces of the wafer.

Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: Rev Sci Instrum Year: 2016 Document type: Article Affiliation country: Corea del Sur

Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: Rev Sci Instrum Year: 2016 Document type: Article Affiliation country: Corea del Sur