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Morphable 3D mesostructures and microelectronic devices by multistable buckling mechanics.
Fu, Haoran; Nan, Kewang; Bai, Wubin; Huang, Wen; Bai, Ke; Lu, Luyao; Zhou, Chaoqun; Liu, Yunpeng; Liu, Fei; Wang, Juntong; Han, Mengdi; Yan, Zheng; Luan, Haiwen; Zhang, Yijie; Zhang, Yutong; Zhao, Jianing; Cheng, Xu; Li, Moyang; Lee, Jung Woo; Liu, Yuan; Fang, Daining; Li, Xiuling; Huang, Yonggang; Zhang, Yihui; Rogers, John A.
Affiliation
  • Fu H; Center for Mechanics and Materials; Center for Flexible Electronics Technology; AML, Department of Engineering Mechanics, Tsinghua University, Beijing, China.
  • Nan K; Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
  • Bai W; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.
  • Huang W; Department of Electrical and Computer Engineering Micro and Nanotechnology Laboratory International Institute for Carbon-Neutral Energy Research (I2CNER), University of Illinois at Urbana-Champaign, Urbana, IL, USA.
  • Bai K; Center for Mechanics and Materials; Center for Flexible Electronics Technology; AML, Department of Engineering Mechanics, Tsinghua University, Beijing, China.
  • Lu L; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.
  • Zhou C; Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
  • Liu Y; Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
  • Liu F; Center for Mechanics and Materials; Center for Flexible Electronics Technology; AML, Department of Engineering Mechanics, Tsinghua University, Beijing, China.
  • Wang J; Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
  • Han M; National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University, Beijing, China.
  • Yan Z; Department of Chemical Engineering and Department of Mechanical & Aerospace Engineering, University of Missouri, Columbia, MO, USA.
  • Luan H; Departments of Civil and Environmental Engineering, Mechanical Engineering, and Materials Science and Engineering, Northwestern University, Evanston, IL, USA.
  • Zhang Y; Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
  • Zhang Y; Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
  • Zhao J; Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
  • Cheng X; Center for Mechanics and Materials; Center for Flexible Electronics Technology; AML, Department of Engineering Mechanics, Tsinghua University, Beijing, China.
  • Li M; Department of Electrical and Computer Engineering Micro and Nanotechnology Laboratory International Institute for Carbon-Neutral Energy Research (I2CNER), University of Illinois at Urbana-Champaign, Urbana, IL, USA.
  • Lee JW; Department of Materials Science and Engineering, Pusan National University, Busan, Republic of Korea.
  • Liu Y; Center for Mechanics and Materials; Center for Flexible Electronics Technology; AML, Department of Engineering Mechanics, Tsinghua University, Beijing, China.
  • Fang D; Institute of Advanced Structure Technology; Beijing Key Laboratory of Lightweight Multi-functional Composite Materials and Structures, Beijing Institute of Technology, Beijing, China.
  • Li X; Department of Electrical and Computer Engineering Micro and Nanotechnology Laboratory International Institute for Carbon-Neutral Energy Research (I2CNER), University of Illinois at Urbana-Champaign, Urbana, IL, USA.
  • Huang Y; Departments of Civil and Environmental Engineering, Mechanical Engineering, and Materials Science and Engineering, Northwestern University, Evanston, IL, USA. y-huang@northwestern.edu.
  • Zhang Y; Center for Mechanics and Materials; Center for Flexible Electronics Technology; AML, Department of Engineering Mechanics, Tsinghua University, Beijing, China. yihuizhang@tsinghua.edu.cn.
  • Rogers JA; Departments of Materials Science and Engineering, Biomedical Engineering, Neurological Surgery, Chemistry, Mechanical Engineering, Electrical Engineering and Computer Science; Center for Bio-Integrated Electronics; and Simpson Querrey Institute for BioNanotechnology, Northwestern University, Evansto
Nat Mater ; 17(3): 268-276, 2018 03.
Article in En | MEDLINE | ID: mdl-29379201
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Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: Nat Mater Journal subject: CIENCIA / QUIMICA Year: 2018 Document type: Article Affiliation country: China
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Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: Nat Mater Journal subject: CIENCIA / QUIMICA Year: 2018 Document type: Article Affiliation country: China