High Performance Seesaw Torsional CMOS-MEMS Relay Using Tungsten VIA Layer.
Micromachines (Basel)
; 9(11)2018 Nov 07.
Article
in En
| MEDLINE
| ID: mdl-30405006
Full text:
1
Collection:
01-internacional
Database:
MEDLINE
Language:
En
Journal:
Micromachines (Basel)
Year:
2018
Document type:
Article
Affiliation country:
España
Country of publication:
Suiza