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High Performance Seesaw Torsional CMOS-MEMS Relay Using Tungsten VIA Layer.
Riverola, Martín; Torres, Francesc; Uranga, Arantxa; Barniol, Núria.
Affiliation
  • Riverola M; Department of Electronics Engineering, Universitat Autònoma de Barcelona, 08193 Bellaterra, Spain. Martin.riverola@gmail.com.
  • Torres F; Department of Electronics Engineering, Universitat Autònoma de Barcelona, 08193 Bellaterra, Spain. francesc.torres@uab.es.
  • Uranga A; Department of Electronics Engineering, Universitat Autònoma de Barcelona, 08193 Bellaterra, Spain. arantxa.uranga@uab.es.
  • Barniol N; Department of Electronics Engineering, Universitat Autònoma de Barcelona, 08193 Bellaterra, Spain. nuria.barniol@uab.cat.
Micromachines (Basel) ; 9(11)2018 Nov 07.
Article in En | MEDLINE | ID: mdl-30405006

Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: Micromachines (Basel) Year: 2018 Document type: Article Affiliation country: España Country of publication: Suiza

Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: Micromachines (Basel) Year: 2018 Document type: Article Affiliation country: España Country of publication: Suiza