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Observation of void formation patterns in SnAg films undergoing electromigration and simulation using random walk methods.
Jin, Zhi; Shen, Yu-An; Zuo, Yang; Chan, Y C; Mannan, S H; Nishikawa, Hiroshi.
Affiliation
  • Jin Z; Graduate School of Engineering, Osaka University, Suita, Japan. jinzhi711@gmail.com.
  • Shen YA; Joining and Welding Research Institute (JWRI), Osaka University, Ibaraki, 5600047, Japan. jinzhi711@gmail.com.
  • Zuo Y; Physics Department, School of Natural & Mathematical Sciences, King's College London, Strand, London, WC2R2LS, UK. jinzhi711@gmail.com.
  • Chan YC; Joining and Welding Research Institute (JWRI), Osaka University, Ibaraki, 5600047, Japan.
  • Mannan SH; Feng Chia University, Taichung, Taiwan (R.O.C.).
  • Nishikawa H; Physics Department, School of Natural & Mathematical Sciences, King's College London, Strand, London, WC2R2LS, UK.
Sci Rep ; 11(1): 8668, 2021 Apr 21.
Article in En | MEDLINE | ID: mdl-33883649
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Full text: 1 Collection: 01-internacional Database: MEDLINE Type of study: Clinical_trials / Prognostic_studies Language: En Journal: Sci Rep Year: 2021 Document type: Article Affiliation country: Japón Country of publication: Reino Unido
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Full text: 1 Collection: 01-internacional Database: MEDLINE Type of study: Clinical_trials / Prognostic_studies Language: En Journal: Sci Rep Year: 2021 Document type: Article Affiliation country: Japón Country of publication: Reino Unido