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Effects of temperature and grain size on diffusivity of aluminium: electromigration experiment and molecular dynamic simulation.
Cui, Zhen; Zhang, Yaqian; Hu, Dong; Vollebregt, Sten; Fan, Jiajie; Fan, Xuejun; Zhang, Guoqi.
Affiliation
  • Cui Z; Department of Microelectronics, Delft University of Technology, 2628 CD, Delft, The Netherlands.
  • Zhang Y; Department of Microelectronics, Delft University of Technology, 2628 CD, Delft, The Netherlands.
  • Hu D; Department of Microelectronics, Delft University of Technology, 2628 CD, Delft, The Netherlands.
  • Vollebregt S; Department of Microelectronics, Delft University of Technology, 2628 CD, Delft, The Netherlands.
  • Fan J; Academy for Engineering & Technology, Fudan University, Shanghai, 200433, People's Republic of China.
  • Fan X; Department of Mechanical Engineering, PO Box 10028, Lamar University, Beaumont, TX 77710, United States of America.
  • Zhang G; Department of Microelectronics, Delft University of Technology, 2628 CD, Delft, The Netherlands.
J Phys Condens Matter ; 34(17)2022 Feb 25.
Article in En | MEDLINE | ID: mdl-35030543
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Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: J Phys Condens Matter Journal subject: BIOFISICA Year: 2022 Document type: Article Affiliation country: Países Bajos
Fulltext
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Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: J Phys Condens Matter Journal subject: BIOFISICA Year: 2022 Document type: Article Affiliation country: Países Bajos