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Universal assembly of liquid metal particles in polymers enables elastic printed circuit board.
Lee, Wonbeom; Kim, Hyunjun; Kang, Inho; Park, Hongjun; Jung, Jiyoung; Lee, Haeseung; Park, Hyunchang; Park, Ji Su; Yuk, Jong Min; Ryu, Seunghwa; Jeong, Jae-Woong; Kang, Jiheong.
Affiliation
  • Lee W; Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea.
  • Kim H; Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea.
  • Kang I; School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea.
  • Park H; Center for Nanomaterials and Chemical Reactions, Institute for Basic Science (IBS), Daejeon 34141, Republic of Korea.
  • Jung J; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea.
  • Lee H; Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea.
  • Park H; Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea.
  • Park JS; Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea.
  • Yuk JM; Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea.
  • Ryu S; Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea.
  • Jeong JW; School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea.
  • Kang J; Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea.
Science ; 378(6620): 637-641, 2022 Nov 11.
Article in En | MEDLINE | ID: mdl-36356149
ABSTRACT
An elastic printed circuit board (E-PCB) is a conductive framework used for the facile assembly of system-level stretchable electronics. E-PCBs require elastic conductors that have high conductivity, high stretchability, tough adhesion to various components, and imperceptible resistance changes even under large strain. We present a liquid metal particle network (LMPNet) assembled by applying an acoustic field to a solid-state insulating liquid metal particle composite as the elastic conductor. The LMPNet conductor satisfies all the aforementioned requirements and enables the fabrication of a multilayered high-density E-PCB, in which numerous electronic components are intimately integrated to create highly stretchable skin electronics. Furthermore, we could generate the LMPNet in various polymer matrices, including hydrogels, self-healing elastomers, and photoresists, thus showing their potential for use in soft electronics.

Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: Science Year: 2022 Document type: Article

Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: Science Year: 2022 Document type: Article
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