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A comparative study of interfacial thermal conductance between metal and semiconductor.
Wu, Kongping; Zhang, Leng; Wang, Danbei; Li, Fangzhen; Zhang, Pengzhan; Sang, Liwen; Liao, Meiyong; Tang, Kun; Ye, Jiandong; Gu, Shulin.
Affiliation
  • Wu K; School of Electronics and Information Engineering, Jinling Institute of Technology, Nanjing, 211169, Jiangsu, China. kpwu@jit.edu.cn.
  • Zhang L; School of Electronics and Information Engineering, Jinling Institute of Technology, Nanjing, 211169, Jiangsu, China.
  • Wang D; School of Electronics and Information Engineering, Jinling Institute of Technology, Nanjing, 211169, Jiangsu, China.
  • Li F; School of Electronics and Information Engineering, Jinling Institute of Technology, Nanjing, 211169, Jiangsu, China.
  • Zhang P; School of Electronics and Information Engineering, Jinling Institute of Technology, Nanjing, 211169, Jiangsu, China.
  • Sang L; Research Center for Functional Materials, National Institute for Materials Science (NIMS), Tsukuba, Ibaraki, 305-0044, Japan.
  • Liao M; Research Center for Functional Materials, National Institute for Materials Science (NIMS), Tsukuba, Ibaraki, 305-0044, Japan. Meiyong.Liao@nims.go.jp.
  • Tang K; School of Electronic Science and Engineering, Nanjing University, Nanjing, 210093, Jiangsu, China.
  • Ye J; School of Electronic Science and Engineering, Nanjing University, Nanjing, 210093, Jiangsu, China.
  • Gu S; School of Electronic Science and Engineering, Nanjing University, Nanjing, 210093, Jiangsu, China.
Sci Rep ; 12(1): 19907, 2022 Nov 19.
Article in En | MEDLINE | ID: mdl-36402811
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Full text: 1 Collection: 01-internacional Database: MEDLINE Type of study: Prognostic_studies Language: En Journal: Sci Rep Year: 2022 Document type: Article Affiliation country: China Country of publication: Reino Unido
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Full text: 1 Collection: 01-internacional Database: MEDLINE Type of study: Prognostic_studies Language: En Journal: Sci Rep Year: 2022 Document type: Article Affiliation country: China Country of publication: Reino Unido