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A wireless and battery-less implant for multimodal closed-loop neuromodulation in small animals.
Ouyang, Wei; Lu, Wei; Zhang, Yamin; Liu, Yiming; Kim, Jong Uk; Shen, Haixu; Wu, Yunyun; Luan, Haiwen; Kilner, Keith; Lee, Stephen P; Lu, Yinsheng; Yang, Yiyuan; Wang, Jin; Yu, Yongjoon; Wegener, Amy J; Moreno, Justin A; Xie, Zhaoqian; Wu, Yixin; Won, Sang Min; Kwon, Kyeongha; Wu, Changsheng; Bai, Wubin; Guo, Hexia; Liu, Tzu-Li; Bai, Hedan; Monti, Giuditta; Zhu, Jason; Madhvapathy, Surabhi R; Trueb, Jacob; Stanslaski, Maria; Higbee-Dempsey, Elizabeth M; Stepien, Iwona; Ghoreishi-Haack, Nayereh; Haney, Chad R; Kim, Tae-Il; Huang, Yonggang; Ghaffari, Roozbeh; Banks, Anthony R; Jhou, Thomas C; Good, Cameron H; Rogers, John A.
Affiliation
  • Ouyang W; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
  • Lu W; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
  • Zhang Y; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
  • Liu Y; Department of Electrical and Computer Engineering, Northwestern University, Evanston, IL, USA.
  • Kim JU; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
  • Shen H; School of Chemical Engineering, Sungkyunkwan University, Suwon, Republic of Korea.
  • Wu Y; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.
  • Luan H; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
  • Kilner K; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
  • Lee SP; Neurolux Inc., Northfield, IL, USA.
  • Lu Y; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
  • Yang Y; Neurolux Inc., Northfield, IL, USA.
  • Wang J; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.
  • Yu Y; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA.
  • Wegener AJ; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.
  • Moreno JA; Neurolux Inc., Northfield, IL, USA.
  • Xie Z; US Army Research Laboratory, Aberdeen Proving Ground, MD, USA.
  • Wu Y; US Army Medical Research Institute of Chemical Defense, Aberdeen Proving Ground, MD, USA.
  • Won SM; US Army Research Laboratory, Aberdeen Proving Ground, MD, USA.
  • Kwon K; US Army Medical Research Institute of Chemical Defense, Aberdeen Proving Ground, MD, USA.
  • Wu C; SURVICE Engineering, Belcamp, MD, USA.
  • Bai W; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.
  • Guo H; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA.
  • Liu TL; Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL, USA.
  • Bai H; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.
  • Monti G; Department of Electrical and Computer Engineering, Sungkyunkwan University, Suwon, Republic of Korea.
  • Zhu J; School of Electrical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.
  • Madhvapathy SR; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
  • Trueb J; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
  • Stanslaski M; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.
  • Higbee-Dempsey EM; Department of Applied Physical Sciences, University of North Carolina at Chapel Hill, Chapel Hill, NC, USA.
  • Stepien I; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.
  • Ghoreishi-Haack N; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA.
  • Haney CR; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
  • Kim TI; Department of Biomedical Engineering, Northwestern University, Evanston, IL, USA.
  • Huang Y; Department of Chemical and Biological Engineering, Northwestern University, Evanston, IL, USA.
  • Ghaffari R; Department of Chemistry, Northwestern University, Evanston, IL, USA.
  • Banks AR; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.
  • Jhou TC; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
  • Good CH; Neurolux Inc., Northfield, IL, USA.
  • Rogers JA; Developmental Therapeutics Core, Northwestern University, Evanston, IL, USA.
Nat Biomed Eng ; 7(10): 1252-1269, 2023 Oct.
Article in En | MEDLINE | ID: mdl-37106153
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Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: Nat Biomed Eng Year: 2023 Document type: Article Affiliation country: Estados Unidos
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Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: Nat Biomed Eng Year: 2023 Document type: Article Affiliation country: Estados Unidos