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Stretchable polymer composites with ultrahigh piezoelectric performance.
Tang, Tongxiang; Shen, Zhonghui; Wang, Jian; Xu, Shiqi; Jiang, Jiaxi; Chang, Jiahui; Guo, Mengfan; Fan, Youjun; Xiao, Yao; Dong, Zhihao; Huang, Houbing; Li, Xiaoyan; Zhang, Yihui; Wang, Danyang; Chen, Long-Qing; Wang, Ke; Zhang, Shujun; Nan, Ce-Wen; Shen, Yang.
Affiliation
  • Tang T; State Key Lab of New Ceramics and Fine Processing, School of Materials Science and Engineering, Tsinghua University, Beijing 100084, China.
  • Shen Z; State Key Laboratory of Advanced Technology for Materials Synthesis and Processing, Center of Smart Materials and Devices, Wuhan University of Technology, Wuhan 430070, China.
  • Wang J; State Key Laboratory of Advanced Technology for Materials Synthesis and Processing, Center of Smart Materials and Devices, Wuhan University of Technology, Wuhan 430070, China.
  • Xu S; Advanced Research Institute of Multidisciplinary Science, Beijing Institute of Technology, Beijing 100081, China.
  • Jiang J; Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China.
  • Chang J; Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China.
  • Guo M; Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, China.
  • Fan Y; State Key Lab of New Ceramics and Fine Processing, School of Materials Science and Engineering, Tsinghua University, Beijing 100084, China.
  • Xiao Y; State Key Lab of New Ceramics and Fine Processing, School of Materials Science and Engineering, Tsinghua University, Beijing 100084, China.
  • Dong Z; State Key Lab of New Ceramics and Fine Processing, School of Materials Science and Engineering, Tsinghua University, Beijing 100084, China.
  • Huang H; State Key Lab of New Ceramics and Fine Processing, School of Materials Science and Engineering, Tsinghua University, Beijing 100084, China.
  • Li X; Advanced Research Institute of Multidisciplinary Science, Beijing Institute of Technology, Beijing 100081, China.
  • Zhang Y; Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China.
  • Wang D; Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China.
  • Chen LQ; Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, China.
  • Wang K; School of Materials Science and Engineering, University of New South Wales, Kensington, NSW 2052, Australia.
  • Zhang S; Department of Materials Science and Engineering, The Pennsylvania State University, State College, PA 16802, USA.
  • Nan CW; State Key Lab of New Ceramics and Fine Processing, School of Materials Science and Engineering, Tsinghua University, Beijing 100084, China.
  • Shen Y; Institute for Superconducting and Electronic Materials, Australian Institute for Innovative Materials, University of Wollongong, Wollongong, NSW 2500, Australia.
Natl Sci Rev ; 10(8): nwad177, 2023 Aug.
Article in En | MEDLINE | ID: mdl-37485000
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Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: Natl Sci Rev Year: 2023 Document type: Article Affiliation country: China Country of publication: China
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Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: Natl Sci Rev Year: 2023 Document type: Article Affiliation country: China Country of publication: China