Revealing the solid-solution interface interference behaviors between Cu2+ and As(III) via partial peak area analysis of simulations and experiments.
Anal Chim Acta
; 1277: 341676, 2023 Oct 09.
Article
in En
| MEDLINE
| ID: mdl-37604614
Full text:
1
Collection:
01-internacional
Database:
MEDLINE
Language:
En
Journal:
Anal Chim Acta
Year:
2023
Document type:
Article
Country of publication:
Países Bajos