A New Silicon Mold Process for Polydimethylsiloxane Microchannels.
Micromachines (Basel)
; 15(7)2024 Jun 29.
Article
in En
| MEDLINE
| ID: mdl-39064358
ABSTRACT
As an alternative to SU-8 soft lithography, a new silicon mold process of fabricating PDMS microchannel chips was proposed. A picosecond laser is used to cut through a 550 µm thick silicon wafer and generate the original microchannel pattern with a 50 µm minimum feature size. This single-crystal silicon pattern, with the edge debris caused by laser cutting being trimmed off by a KOH solution and with the protection field oxide layer being removed by BOE afterwards, firmly resided on a glass substrate through the anodic bonding technique. Four-inch wafers with microchannel patterns as the PDMS mold cores were successfully bonded on Pyrex 7740 or Eagle XG glass substrates for the follow-up PDMS molding/demolding process. This new maskless process does not need a photolithography facility, but the laser cutting service must be provided by professional off-campus companies. One PDMS microchannel chip for particle separation was shown as an example of what can be achieved when using this new process.
Full text:
1
Collection:
01-internacional
Database:
MEDLINE
Language:
En
Journal:
Micromachines (Basel)
Year:
2024
Document type:
Article
Affiliation country:
Taiwán
Country of publication:
Suiza