Low-dielectric constant insulators for future integrated circuits and packages.
Annu Rev Chem Biomol Eng
; 2: 379-401, 2011.
Article
in En
| MEDLINE
| ID: mdl-22432624
ABSTRACT
Future integrated circuits and packages will require extraordinary dielectric materials for interconnects to allow transistor advances to be translated into system-level advances. Exceedingly low-permittivity and low-loss materials are required at every level of the electronic system, from chip-level insulators to packages and printed wiring boards. In this review, the requirements and goals for future insulators are discussed followed by a summary of current state-of-the-art materials and technical approaches. Much work needs to be done for insulating materials and structures to meet future needs.
Full text:
1
Collection:
01-internacional
Database:
MEDLINE
Main subject:
Electronics
/
Equipment Design
/
Microtechnology
Type of study:
Prognostic_studies
Language:
En
Journal:
Annu Rev Chem Biomol Eng
Year:
2011
Document type:
Article
Affiliation country:
United States