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Thermal Conduction across Metal-Dielectric Sidewall Interfaces.
Park, Woosung; Kodama, Takashi; Park, Joonsuk; Cho, Jungwan; Sood, Aditya; Barako, Michael T; Asheghi, Mehdi; Goodson, Kenneth E.
Affiliation
  • Kodama T; Department of Mechanical Engineering, University of Tokyo , 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan.
  • Cho J; Department of Mechanical Engineering, Kyung Hee University , 1732 Deogyoung-daero, Giheung-gu, Yongin-si, Gyeounggi-do 446-701, South Korea.
  • Barako MT; NG Next, Northrop Grumman Aerospace Systems , Redondo Beach, California 90278, United States.
ACS Appl Mater Interfaces ; 9(35): 30100-30106, 2017 Sep 06.
Article in En | MEDLINE | ID: mdl-28786284
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Full text: 1 Collection: 01-internacional Database: MEDLINE Type of study: Prognostic_studies Language: En Journal: ACS Appl Mater Interfaces Journal subject: BIOTECNOLOGIA / ENGENHARIA BIOMEDICA Year: 2017 Document type: Article Country of publication: United States
Fulltext
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Full text: 1 Collection: 01-internacional Database: MEDLINE Type of study: Prognostic_studies Language: En Journal: ACS Appl Mater Interfaces Journal subject: BIOTECNOLOGIA / ENGENHARIA BIOMEDICA Year: 2017 Document type: Article Country of publication: United States