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Bottom-Up Electrodeposition of Large-Scale Nanotwinned Copper within 3D Through Silicon Via.
Sun, Fu-Long; Liu, Zhi-Quan; Li, Cai-Fu; Zhu, Qing-Sheng; Zhang, Hao; Suganuma, Katsuaki.
Affiliation
  • Sun FL; Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China. flsun12s@imr.ac.cn.
  • Liu ZQ; University of Chinese Academy of Sciences, Beijing 100049, China. flsun12s@imr.ac.cn.
  • Li CF; Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China. zqliu@imr.ac.cn.
  • Zhu QS; University of Chinese Academy of Sciences, Beijing 100049, China. zqliu@imr.ac.cn.
  • Zhang H; Institute of Scientific and Industrial Research, Osaka University, Osaka 5670047, Japan. zqliu@imr.ac.cn.
  • Suganuma K; Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China. licf@alum.imr.ac.cn.
Materials (Basel) ; 11(2)2018 Feb 23.
Article in En | MEDLINE | ID: mdl-29473865
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Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: Materials (Basel) Year: 2018 Document type: Article Affiliation country: China
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Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: Materials (Basel) Year: 2018 Document type: Article Affiliation country: China