Solder Joint Reliability Risk Estimation by AI-Assisted Simulation Framework with Genetic Algorithm to Optimize the Initial Parameters for AI Models.

Yuan, Cadmus; Fan, Xuejun; Zhang, Gouqi

Yuan, Cadmus; Fan, Xuejun; Zhang, Gouqi.

Affiliation

Yuan C; Department of Mechanical and Computer-Aided Engineering, Feng Chia University, Taichung 407082, Taiwan.
Fan X; Department of Mechanical Engineering, Lamar University, Beaumont, TX 77710, USA.
Zhang G; Department of Electronic Components, Technology, and Materials, Delft University of Technology, 2628 CD Delft, The Netherlands.

Materials (Basel) ; 14(17)2021 Aug 26.

Article in En | MEDLINE | ID: mdl-34500925

Key words

artificial neural network; generic algorithm; principle component analysis; recurrent neural network; solder joint fatigue risk estimation; time/temperature-dependent nonlinearity; wafer level chip-scaled packaging

Fulltext

Add to My VHL

XML

PubMed Links

Search on Google

Full text: 1 Collection: 01-internacional Database: MEDLINE Type of study: Etiology_studies / Prognostic_studies / Risk_factors_studies Language: En Journal: Materials (Basel) Year: 2021 Document type: Article Affiliation country: Taiwan Country of publication: Switzerland

Fulltext

Add to My VHL

XML

PubMed Links

Search on Google