Recent Advances on Thermally Conductive Adhesive in Electronic Packaging: A Review.
Polymers (Basel)
; 13(19)2021 Sep 29.
Article
in En
| MEDLINE
| ID: mdl-34641155
ABSTRACT
The application of epoxy adhesive is widespread in electronic packaging. Epoxy adhesives can be integrated with various types of nanoparticles for enhancing thermal conductivity. The joints with thermally conductive adhesive (TCA) are preferred for research and advances in thermal management. Many studies have been conducted to increase the thermal conductivity of epoxy-based TCAs by conductive fillers. This paper reviews and summarizes recent advances of these available fillers in TCAs that contribute to electronic packaging. It also covers the challenges of using the filler as a nano-composite. Moreover, the review reveals a broad scope for future research, particularly on thermal management by nanoparticles and improving bonding strength in electronic packaging.
Full text:
1
Collection:
01-internacional
Database:
MEDLINE
Language:
En
Journal:
Polymers (Basel)
Year:
2021
Document type:
Article
Affiliation country:
Malaysia