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Hollow polymer microcapsule embedded transparent and heat-insulating film.
Kim, Chae Bin; You, Nam-Ho; Goh, Munju.
Affiliation
  • Kim CB; Institute of Advanced Composite Materials, Korea Institute of Science and Technology (KIST) Chudong-ro 92, Bongdong-eup Wanju-gun Jeonbuk-do 55324 Korea goh@kist.re.kr.
  • You NH; Institute of Advanced Composite Materials, Korea Institute of Science and Technology (KIST) Chudong-ro 92, Bongdong-eup Wanju-gun Jeonbuk-do 55324 Korea goh@kist.re.kr.
  • Goh M; Institute of Advanced Composite Materials, Korea Institute of Science and Technology (KIST) Chudong-ro 92, Bongdong-eup Wanju-gun Jeonbuk-do 55324 Korea goh@kist.re.kr.
RSC Adv ; 8(17): 9480-9486, 2018 Feb 28.
Article in En | MEDLINE | ID: mdl-35541891
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Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: RSC Adv Year: 2018 Document type: Article Country of publication: United kingdom
Fulltext
Add to My VHL
Print
XML
PubMed Links
Search on Google

Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: RSC Adv Year: 2018 Document type: Article Country of publication: United kingdom