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Chip-less wireless electronic skins by remote epitaxial freestanding compound semiconductors.
Kim, Yeongin; Suh, Jun Min; Shin, Jiho; Liu, Yunpeng; Yeon, Hanwool; Qiao, Kuan; Kum, Hyun S; Kim, Chansoo; Lee, Han Eol; Choi, Chanyeol; Kim, Hyunseok; Lee, Doyoon; Lee, Jaeyong; Kang, Ji-Hoon; Park, Bo-In; Kang, Sungsu; Kim, Jihoon; Kim, Sungkyu; Perozek, Joshua A; Wang, Kejia; Park, Yongmo; Kishen, Kumar; Kong, Lingping; Palacios, Tomás; Park, Jungwon; Park, Min-Chul; Kim, Hyung-Jun; Lee, Yun Seog; Lee, Kyusang; Bae, Sang-Hoon; Kong, Wei; Han, Jiyeon; Kim, Jeehwan.
Affiliation
  • Kim Y; Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139, USA.
  • Suh JM; Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA 02139, USA.
  • Shin J; Department of Electrical Engineering and Computer Science, University of Cincinnati, Cincinnati, OH 45219, USA.
  • Liu Y; Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139, USA.
  • Yeon H; Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA 02139, USA.
  • Qiao K; Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139, USA.
  • Kum HS; Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA 02139, USA.
  • Kim C; Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139, USA.
  • Lee HE; Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA 02139, USA.
  • Choi C; Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139, USA.
  • Kim H; Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA 02139, USA.
  • Lee D; School of Materials Science and Engineering, Gwangju Institute of Science and Technology, Gwangju 61005, South Korea.
  • Lee J; Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139, USA.
  • Kang JH; Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA 02139, USA.
  • Park BI; Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139, USA.
  • Kang S; Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA 02139, USA.
  • Kim J; Department of Electrical and Electronic Engineering, Yonsei University, Seoul 03722, South Korea.
  • Kim S; Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139, USA.
  • Perozek JA; Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA 02139, USA.
  • Wang K; Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139, USA.
  • Park Y; Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA 02139, USA.
  • Kishen K; Division of Advanced Materials Engineering, Jeonbuk National University, Jeonju 54896, South Korea.
  • Kong L; Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology, Cambridge, MA 02139, USA.
  • Palacios T; Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139, USA.
  • Park J; Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA 02139, USA.
  • Park MC; Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139, USA.
  • Kim HJ; Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA 02139, USA.
  • Lee YS; Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139, USA.
  • Lee K; Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA 02139, USA.
  • Bae SH; Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA 02139, USA.
  • Kong W; School of Chemical and Biological Engineering, Institute of Chemical Process, Seoul National University, Seoul 08826, South Korea.
  • Han J; School of Chemical and Biological Engineering, Institute of Chemical Process, Seoul National University, Seoul 08826, South Korea.
  • Kim J; Department of Nanotechnology and Advanced Materials Engineering, Sejong University, Seoul 05006, South Korea.
Science ; 377(6608): 859-864, 2022 08 19.
Article in En | MEDLINE | ID: mdl-35981034
ABSTRACT
Recent advances in flexible and stretchable electronics have led to a surge of electronic skin (e-skin)-based health monitoring platforms. Conventional wireless e-skins rely on rigid integrated circuit chips that compromise the overall flexibility and consume considerable power. Chip-less wireless e-skins based on inductor-capacitor resonators are limited to mechanical sensors with low sensitivities. We report a chip-less wireless e-skin based on surface acoustic wave sensors made of freestanding ultrathin single-crystalline piezoelectric gallium nitride membranes. Surface acoustic wave-based e-skin offers highly sensitive, low-power, and long-term sensing of strain, ultraviolet light, and ion concentrations in sweat. We demonstrate weeklong monitoring of pulse. These results present routes to inexpensive and versatile low-power, high-sensitivity platforms for wireless health monitoring devices.
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Full text: 1 Collection: 01-internacional Database: MEDLINE Main subject: Remote Sensing Technology / Wearable Electronic Devices / Monitoring, Physiologic Limits: Humans Language: En Journal: Science Year: 2022 Document type: Article Affiliation country: United States Publication country: EEUU / ESTADOS UNIDOS / ESTADOS UNIDOS DA AMERICA / EUA / UNITED STATES / UNITED STATES OF AMERICA / US / USA
Fulltext
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Full text: 1 Collection: 01-internacional Database: MEDLINE Main subject: Remote Sensing Technology / Wearable Electronic Devices / Monitoring, Physiologic Limits: Humans Language: En Journal: Science Year: 2022 Document type: Article Affiliation country: United States Publication country: EEUU / ESTADOS UNIDOS / ESTADOS UNIDOS DA AMERICA / EUA / UNITED STATES / UNITED STATES OF AMERICA / US / USA