Characterization of thin film Parylene C device curvature and the formation of helices via thermoforming.
J Micromech Microeng
; 33(9): 095007, 2023 Sep 01.
Article
in En
| MEDLINE
| ID: mdl-37520061
Full text:
1
Collection:
01-internacional
Database:
MEDLINE
Language:
En
Journal:
J Micromech Microeng
Year:
2023
Document type:
Article
Affiliation country:
United States
Country of publication:
United kingdom