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High-Speed 4D-STEM using Electrostatic Subframing.
Reed, B W; Bloom, R S; Yagi, K; Masiel, D J.
Affiliation
  • Reed BW; Integrated Dynamic Electron Solutions, Inc., Pleasanton, CA, United States.
  • Bloom RS; Integrated Dynamic Electron Solutions, Inc., Pleasanton, CA, United States.
  • Yagi K; Integrated Dynamic Electron Solutions, Inc., Pleasanton, CA, United States.
  • Masiel DJ; Integrated Dynamic Electron Solutions, Inc., Pleasanton, CA, United States.
Microsc Microanal ; 29(Supplement_1): 298-299, 2023 Jul 22.
Article in En | MEDLINE | ID: mdl-37613532
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Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: Microsc Microanal Year: 2023 Document type: Article Affiliation country: United States Country of publication: United kingdom
Fulltext
Add to My VHL
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Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: Microsc Microanal Year: 2023 Document type: Article Affiliation country: United States Country of publication: United kingdom