A Sensitivity-Enhanced Vertical-Resonant MEMS Electric Field Sensor Based on TGV Technology.
Micromachines (Basel)
; 15(3)2024 Feb 29.
Article
in En
| MEDLINE
| ID: mdl-38542603
ABSTRACT
In order to enhance the sensitivity of wafer-level vacuum-packaged electric field sensors, this paper proposed a vertical-resonant MEMS electric field sensor based on TGV (Through Glass Via) technology. The microsensor is composed of the electric field sensing cover, the drive cover, and the SOI-based microstructures between them. TGV technology is innovatively used to fabricate the electric field sensing cover and the vertically-driven cover. The external electric field is concentrated and transmitted to the area below the silicon plate in the center of the electric field sensing cover through a metal plate and a metal pillar, reducing the coupling capacitance between the silicon plate and the packaging structure, thereby achieving the enhanced transmission of the electric field. The sensitivity-enhanced mechanism of the sensor is analyzed, and the key parameters of the sensor are optimized through finite element simulation. The fabrication process is designed and realized. A prototype is tested to characterize its performance. The experimental results indicate that the sensitivity of the sensor is 0.82 mV/(kV/m) within the electrostatic electric field ranging from 0-50 kV/m. The linearity of the sensor is 0.65%.
Full text:
1
Collection:
01-internacional
Database:
MEDLINE
Language:
En
Journal:
Micromachines (Basel)
Year:
2024
Document type:
Article
Affiliation country:
China