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Next-generation biocontainment systems for engineered organisms.
Lee, Jeong Wook; Chan, Clement T Y; Slomovic, Shimyn; Collins, James J.
Afiliación
  • Lee JW; Wyss Institute for Biologically Inspired Engineering, Harvard University, Boston, MA, USA.
  • Chan CTY; Department of Chemical Engineering, Pohang University of Science and Technology, Pohang, Gyeongbuk, Republic of Korea.
  • Slomovic S; Institute for Medical Engineering & Science, Massachusetts Institute of Technology (MIT), Cambridge, MA, USA.
  • Collins JJ; Department of Biological Engineering, MIT, Cambridge, MA, USA.
Nat Chem Biol ; 14(6): 530-537, 2018 06.
Article en En | MEDLINE | ID: mdl-29769737
The increasing use of engineered organisms for industrial, clinical, and environmental applications poses a growing risk of spreading hazardous biological entities into the environment. To address this biosafety issue, significant effort has been invested in creating ways to confine these organisms and transgenic materials. Emerging technologies in synthetic biology involving genetic circuit engineering, genome editing, and gene expression regulation have led to the development of novel biocontainment systems. In this perspective, we highlight recent advances in biocontainment and suggest a number of approaches for future development, which may be applied to overcome remaining challenges in safeguard implementation.
Asunto(s)

Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Asunto principal: Ingeniería Genética / Contención de Riesgos Biológicos Límite: Humans Idioma: En Revista: Nat Chem Biol Asunto de la revista: BIOLOGIA / QUIMICA Año: 2018 Tipo del documento: Article País de afiliación: Estados Unidos Pais de publicación: Estados Unidos

Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Asunto principal: Ingeniería Genética / Contención de Riesgos Biológicos Límite: Humans Idioma: En Revista: Nat Chem Biol Asunto de la revista: BIOLOGIA / QUIMICA Año: 2018 Tipo del documento: Article País de afiliación: Estados Unidos Pais de publicación: Estados Unidos