Your browser doesn't support javascript.
loading
Designing Surface Chemistry of Silver Nanocrystals for Radio Frequency Circuit Applications.
Oh, Hanju; Lee, Seung-Wook; Kim, Minsoo; Lee, Woo Seok; Seong, Mingi; Joh, Hyungmok; Allen, Mark G; May, Gary S; Bakir, Muhannad S; Oh, Soong Ju.
Afiliación
  • Oh H; School of Electrical and Computer Engineering , Georgia Institute of Technology , Atlanta , Georgia 30332 , United States.
  • Lee SW; Singh Center for Nanotechnology & Department of Electrical and Systems Engineering , University of Pennsylvania , Philadelphia , Pennsylvania 19104 , United States.
  • Lee WS; Singh Center for Nanotechnology & Department of Electrical and Systems Engineering , University of Pennsylvania , Philadelphia , Pennsylvania 19104 , United States.
  • May GS; Singh Center for Nanotechnology & Department of Electrical and Systems Engineering , University of Pennsylvania , Philadelphia , Pennsylvania 19104 , United States.
  • Bakir MS; School of Electrical and Computer Engineering , Georgia Institute of Technology , Atlanta , Georgia 30332 , United States.
  • Oh SJ; University of California , Davis , California 95616 , United States.
ACS Appl Mater Interfaces ; 10(43): 37643-37650, 2018 Oct 31.
Article en En | MEDLINE | ID: mdl-30288975
We introduce solution-based, room temperature- and atmospheric pressure-processed silver nanocrystal (Ag NC)-based electrical circuits and interconnects for radio frequency (RF)/microwave frequency applications. We chemically designed the surface and interface states of Ag NC thin films to achieve high stability, dc and ac conductivity, and minimized RF loss through stepwise ligand exchange, shell coating, and surface cleaning. The chemical and structural properties of the circuits and interconnects affect the high-frequency electrical performance of Ag NC thin films, as confirmed by high-frequency electromagnetic field simulations. An all solution-based process is developed to build coplanar structures, in which Ag NC thin films are positioned at both sides of the substrates. In addition, we fabricated flexible transmission lines and broadband electrical circuits for resistors, interdigitated capacitors, spiral and omega-shaped inductors, and patch antennas with maximum inductance and capacitance values of 3 nH and 2.5 pF at frequencies up to 20 GHz. We believe that our approach will lead to a cost-effective realization of RF circuits and devices in which sensing and wireless communication capabilities are combined for internet-of-things applications.
Palabras clave

Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: ACS Appl Mater Interfaces Asunto de la revista: BIOTECNOLOGIA / ENGENHARIA BIOMEDICA Año: 2018 Tipo del documento: Article País de afiliación: Estados Unidos Pais de publicación: Estados Unidos

Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: ACS Appl Mater Interfaces Asunto de la revista: BIOTECNOLOGIA / ENGENHARIA BIOMEDICA Año: 2018 Tipo del documento: Article País de afiliación: Estados Unidos Pais de publicación: Estados Unidos