Ultra-Stretchable Interconnects for High-Density Stretchable Electronics.

Shafqat, Salman; Hoefnagels, Johan P M; Savov, Angel; Joshi, Shivani; Dekker, Ronald; Geers, Marc G D

Shafqat, Salman; Hoefnagels, Johan P M; Savov, Angel; Joshi, Shivani; Dekker, Ronald; Geers, Marc G D.

Afiliación

Shafqat S; Department of Mechanical Engineering, Eindhoven University of Technology, 5600 MB Eindhoven, The Netherlands. s.shafqat@tue.nl.
Hoefnagels JPM; Department of Mechanical Engineering, Eindhoven University of Technology, 5600 MB Eindhoven, The Netherlands. j.p.m.hoefnagels@tue.nl.
Savov A; Department of Microelectronics, Delft University of Technology, 2628 CD Delft, The Netherlands. angel.savov@philips.com.
Joshi S; Department of Microelectronics, Delft University of Technology, 2628 CD Delft, The Netherlands. shivani.joshi@philips.com.
Dekker R; Department of Microelectronics, Delft University of Technology, 2628 CD Delft, The Netherlands. ronald.dekker@philips.com.
Geers MGD; Philips Research, High Tech Campus 4, 5656 AE Eindhoven, The Netherlands. ronald.dekker@philips.com.

Micromachines (Basel) ; 8(9)2017 Sep 13.

Article en En | MEDLINE | ID: mdl-30400467

Palabras clave

complementary metal-oxide semiconductor (CMOS) processing; mechanical size-effects; miniaturized interconnects; stretchable electronics; ultra-stretchability

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Texto completo: 1 Colección: 01-internacional Base de datos: MEDLINE Idioma: En Revista: Micromachines (Basel) Año: 2017 Tipo del documento: Article País de afiliación: Países Bajos Pais de publicación: Suiza

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